#Direct-to-Chip
The big picture

Chip makers are racing to own AI software layers, not just hardware. AMD buying spatial AI technology is a direct move to compete with NVIDIA on the full AI stack.
September 29, 2026 at 12:47 PM
He's buying his loyalty chip with Trump in oder to direct Fat Man's rage after the midterms somewhere else.
September 29, 2026 at 6:49 AM
Sources: China expands its foreign travel restrictions to include the direct relatives, such as spouses and children, of certain key AI and chip executives (Bloomberg)

Main Link | Techmeme Permalink
September 28, 2026 at 10:35 AM
Motorola Signature 27 Challenges Samsung Galaxy in US

The Signature 27 pairs Qualcomm's new Snapdragon 8 Elite Extreme Gen 6 with a 200 megapixel periscope camera and integrated... #Motorola
Motorola Signature 27 Challenges Samsung Galaxy in US
Motorola is making its most direct challenge yet to Samsung’s dominance in the ultra premium Android market. The new Motorola Signature 27, unveiled in September 2026, aims squarely at the Galaxy Ultra line with top tier specifications built around Qualcomm’s newest flagship chip. A New Flagship Chip Leads the Way The Signature 27 pairs Qualcomm’s […]
hashlytics.io
September 26, 2026 at 2:40 PM
Trump har reelt givet kineserne adgang til højtydende grafikkort gennem UAE.

& Kina fandt en vej uden brug af de forbudte GPU under Biden.

(som for nogle GPUs vedkommende bliver produceret i Kina...)
www.cnbc.com/2025/11/20/u...
U.S. greenlights AI chip exports to Gulf tech giants after Saudi Crown Prince's Washington visit
The approval marks a major reversal for the U.S., which had previously balked at the idea of direct exports to state-backed AI companies in the Gulf.
www.cnbc.com
September 26, 2026 at 9:39 AM
Anomaly: Ohio pilot casting call! I'm working on a pilot that will, hopefully, become an animatic pilot. For now, it'll be an audio only pilot.

It's volunteer for now, but just for the pilot. Picrews used smile point and Black Centered.

Just reply with your reels or websites, please!
September 26, 2026 at 12:35 AM
OVHcloud US General Manager Jeffrey Gregor told Business Insight Journal why AI heat is making cooling strategic, and how 20+ years of direct-to-chip cooling keeps water use low.

https://bi-journal.com/business-insight-journal-interview-with-jeffrey-gregor/
September 24, 2026 at 5:10 PM
Snapdragon Sound Elite Gen 2 is built for smarter earbuds with AI, better ANC, and clearer calls

Qualcomm has unveiled Snapdragon Sound Elite Gen 2, its latest audio platform for earbuds, headphones, and other wearables. The chip debuted at Snapdragon Summit 2026 alongside the new Snapdragon 8…
Snapdragon Sound Elite Gen 2 is built for smarter earbuds with AI, better ANC, and clearer calls
Qualcomm has unveiled Snapdragon Sound Elite Gen 2, its latest audio platform for earbuds, headphones, and other wearables. The chip debuted at Snapdragon Summit 2026 alongside the new Snapdragon 8 Elite Gen 6 mobile processors. It brings up to twice the AI capability of its predecessor, direct cloud access through micro-power Wi-Fi 6E, and a new set of features built around always-available AI assistants.
articlweblog.com
September 24, 2026 at 2:12 PM
One link for 12 families, 2 displacement camps, and a community center. The world has robbed them of so much dignity, and now the dignity of being named individually.

Chip in a coffee and make it recurring. I'll direct it to the most stagnant fund. tiny.cc/divyafunds
September 24, 2026 at 11:02 AM
🔥 NEW ON TECH BOSS:
Nvidia Blackwell NVL72 Racks Face Severe Liquid Cooling and Overheating Hurdles in Hyperscaler Cloud Centers

Read the full guide 👇
https://imtechboss.com/post?id=nvidia-blackwell-nvl72-liquid-cooling-overheating-hurdles-2026

#Nvidia #Blackwell #AIHardware
Nvidia Blackwell NVL72 Racks Face Severe Liquid Cooling and Overheating Hurdles in Hyperscaler Cloud Centers
Hyperscale cloud providers report unexpected thermal density issues with Nvidia's flagship 120kW NVL72 AI racks. Here is how direct-to-chip liquid cooling and manifold redesigns are altering deployment roadmaps.
imtechboss.com
September 24, 2026 at 9:21 AM
🔥 NEW ON TECH BOSS:
Nvidia Blackwell NVL72 Racks Face Severe Liquid Cooling and Overheating Hurdles in Hyperscaler Cloud Centers

Read the full guide 👇
https://imtechboss.com/post?id=nvidia-blackwell-nvl72-racks-liquid-cooling-overheating-hyperscalers-2026

#Nvidia #Blackwell #AIHardware
Nvidia Blackwell NVL72 Racks Face Severe Liquid Cooling and Overheating Hurdles in Hyperscaler Cloud Centers
Hyperscale cloud providers report unexpected thermal density issues with Nvidia's flagship 120kW NVL72 AI racks. Here is how direct-to-chip liquid cooling and manifold redesigns are altering deployment roadmaps.
imtechboss.com
September 24, 2026 at 8:41 AM
Air cooling has hit the thermal wall! 🛑 With NVIDIA Blackwell GPUs exceeding 1,000W TDP, 120kW AI server racks demand direct-to-chip (D2C) liquid cooling to prevent thermal throttling and optimize PUE down to 1.05. ⚡️🧊

Read the report: www.idatam.com/blogs/liquid...
September 24, 2026 at 6:50 AM
You should consider the 2020 fourth-gen iPad Pro. This has the A12Z chip, which is basically the direct ancestor of the M1 Mac chip, and it runs the latest version of iPadOS. Tech YouTuber Luke Miami also made a great point about how this iPad Pro is the most powerful the iPad has ever needed to be.
September 24, 2026 at 12:11 AM
Although this article—which channeled form to my diffuse vexation—mentions Microsoft designed its quantum chip “with the help of AI” w/no additional details so it still has an AI angle.

DARPA= Defense Advanced Projects Research Agency
Microsoft to give DARPA hands-on access to quantum system at new Maryland site
Microsoft on Tuesday said it will give the US Defense Advanced Research Projects Agency direct, on-site access to its latest quantum ​computing hardware as part of a new research center the company ‌o...
www.reuters.com
September 23, 2026 at 2:54 AM
Forget performance: Qualcomm’s new phone chip is all about AI agents
Qualcomm is back at its Snapdragon Summit in Hawaii, which means only one thing: new flagship Android chipsets are here. Only this time, there are two to choose from. The Snapdragon 8 Elite Gen 6 is the direct successor to last year’s 8 Elite Gen 5, but it’s now joined by a brand-new “Extreme” variant. So, why has Qualcomm decided to launch a second version of what is already the most capable Android silicon? Two words: agentic AI. ## Who run this phone? AI (maybe) Every time I review an Android flagship running Qualcomm’s latest and greatest chipset, I make a comment along the lines of it seemingly having loads of performance in reserve. For many years, Snapdragon silicon has stayed ahead of the curve, even following the explosion of generative AI tools in 2023. Qualcomm Now, though, Qualcomm feels like it has to do so again. It explicitly describes the Snapdragon 8 Elite Extreme Gen 6 as a higher tier that’s specifically designed for the “agentic AI era”. AI tools that work mostly independently across multi-step processes and complex workflows are incredibly power-hungry. Qualcomm has responded by significantly upgrading basically every part of its new chipset. In terms of pure output, the Oryon CPU is unmatched in the industry. Qualcomm claims it’s the “world’s first 5GHz mobile CPU”, reaching a new milestone for pure output on its two prime cores. These are joined by six performance cores that can hit 4GHz speeds. The Adreno GPU incorporates three matrix cores, which use Qualcomm’s Adreno Neural Fusion tech to run AI workloads directly within the GPU rather than offloading them to the NPU. Qualcomm Qualcomm says this leads to a 40% reduction in power demands (based on internal testing with the game Dragon Alley) and should enable longer high-end gaming sessions than any other mobile chipset. Just as important is the Sensing Hub. It’s where the voice input from the user comes in and is processed – always on-device and with supposedly low latency. Combined, these components should enable the efficient, complex workflows designed to make agentic AI as smooth and fast as possible. ## Which devices will get it? Qualcomm says that the Snapdragon 8 Elite Extreme Gen 6 is designed for “the pinnacle of tech” and “elite mobile flagships”. In other words, it’ll likely be reserved for some of the most expensive smartphones you can buy. The first device is already confirmed, as it’s launching alongside the chipset: the Motorola Signature 27. Motorola Other devices aren’t yet known, but the Samsung Galaxy S27 Ultra, Oppo Find X10 Pro Max, Xiaomi 18 Pro Max and Honor Magic 9 Pro Max are all likely candidates. It wouldn’t be a surprise to see the non-Ultra and Pro Max-branded devices drop down to the regular Snapdragon 8 Elite Gen 6 instead, though.
www.techadvisor.com
September 22, 2026 at 8:49 PM
T-Head mapped Yitian 720 and 730 server CPUs for 2027 and noted Yitian 750 to ICN-Link Zhenwu.

Source: Pandaily
T-Head Maps Yitian 720 and 730 Server CPUs for 2027; Yitian 750 to ICN-Link Zhenwu
At Apsara 2026, T-Head outlined Yitian 720 and 730 server CPUs for 2027 and a later Yitian 750 that adds ICN-link direct attach to Zhenwu AI accelerators—CPU roadmap, not a Zhenwu V900 chip unveil.
pandaily.com
September 22, 2026 at 9:56 AM
Yapay zeka ajanları artık sadece yazılım kodu yazmıyor, kendi çiplerini tasarlıyor! Yeni bir araştırma, LLM ajanlarının insan mühendislerden çok daha yüksek soyutlama seviyeleriyle otonom donanım geliştirebildiğini gösteriyor. 💻🤖 (1/3)
Can Agents Design Better Chips with a Higher Level Abstraction?
Large Language Model (LLM) agents are increasingly being explored for chip design, but most existing approaches operate directly at RTL. We ask whether agents can design better chips by leveraging higher-level abstractions. We compare Direct RTL Design, Agent-based HLS Design, Post-Compiler HLS Refinement, and Post-HLS RTL Refinement, and combine Agent-based HLS Design with Post-HLS RTL Refinement as Agent-based HLS with RTL Refinement (AHRR). We use FPGAs as a practical, easy-to-deploy platform for end-to-end evaluation, but note that the design-flow tradeoffs we study are largely independent of the target technology. Across a diverse 11-tasks benchmark suite, AHRR achieves a 2.6$\times$ geometric-mean speedup over Direct RTL Design across our benchmark suite. Case studies show that HLS distills design knowledge into abstractions that agents can leverage, while RTL refinement recovers lower-level optimization opportunities. Together, these results make AHRR a promising workflow for agentic chip design. The code and evaluation artifacts are available at https://github.com/ZijD/AHRR.
arxiv.org
September 21, 2026 at 11:04 AM
#LAES SEALSQ, WISeKey and Canton of Jura Sign MoU to Establish a Swiss Post-Quantum Semiconductor and Cybersecurity Center

https://www.stocktitan.net/news/LAES/sealsq-wi-se-key-and-canton-of-jura-sign-mo-u-to-establish-a-swiss-b9eozgrfcwlf.html?utm_source=stocktitan-bluesky&utm_medium=social
SEALSQ, WISeKey and Canton of Jura Sign MoU to Establish a Swiss Post-Quantum Semiconductor and Cybersecurity Center
SEALSQ (LAES) plans a CHF 40–60 million post‑quantum semiconductor center in Jura, Switzerland under a new MoU.The Memorandum of Understanding between SEALSQ, parent WISeKey and the Canton of Jura targets a six‑year public‑private initiative to establish Swiss capabilities in post‑quantum chip design, personalization, testing and secure provisioning, built around SEALSQ’s QS7001 Quantum Shield device. The Jura Center is planned to create about 40 direct jobs within two years, 150 by Year 5 and more than 250 by Year 8, with at least 60% of roles expected to go to Jura residents.Financing is expected to come mainly from WISeKey, SEALSQ, private investors and industrial partners, with the canton acting as catalyst. The model builds on the EUR 40 million Quantix Edge Security center in Murcia, Spain, which generated initial revenue in Q2 2026. Next steps include forming a joint working group, defining a detailed business plan and moving from MoU to a binding implementation framework.
www.stocktitan.net
September 21, 2026 at 5:00 AM