#GlassSubstrates
Glass substrates may reach mass production before CPO as AI chip packages grow, but can they overcome TGV, warpage, and copper filling challenges?
#Glasssubstrates #CPO #chip #TGV #$GLW #$AMAT
chippub.substack.com/p/glass-subs...
Glass Substrates Catch Up
Glass substrates may reach mass production before CPO, easing warpage and size limits in next-gen AI chip packaging.
chippub.substack.com
October 12, 2026 at 7:27 AM
www.investing.com
April 21, 2025 at 7:38 PM
A Intel anunciou um avanço na fabricação de semicondutores com a tecnologia de empacotamento avançado:

• Superação de limites físicos tradicionais
• Viabilização de chips de dimensões ampliadas
• Ganho em densidade e eficiência energética

#IntelFoundry #GlassSubstrates #Semicondutores
August 1, 2026 at 1:00 AM
Special Report: Glass Substrates Gain Momentum:
semiengineering.com/glass-substr...

#semiconductor #GlassSubstrates
Glass Substrates Gain Momentum
Benefits increase with package size, but not all the kinks have been worked out.
semiengineering.com
October 5, 2025 at 3:46 PM