HSINCHU, March 14, 2025 /PRNewswire/ — InPsytech, Inc., a leading provider of high-performance semiconductor intellectual property (IP) solutions under Egis Group, is pleased to announce its participation in the Intel Foundry Accelerator IP Alliance. The…

Discover InPsytech's groundbreaking 3nm UCIe 3.0 technology showcased at the OCP Global Summit 2025, driving innovation in the chiplet ecosystem.

InPsytech showcases its cutting-edge UCIe 3.0 technology at OCP 2025, emphasizing rapid advancements in chiplet integration and semiconductor efficiency.

InPsytech showcases its advanced UCIe 3.0 technology at the 2025 OCP Summit in San Jose, highlighting innovations in the chiplet ecosystem.

InPsytech showcases its latest 3nm UCIe 3.0 technology at OCP 2025, highlighting its advancements in chiplet integration and the semiconductor industry.

InPsytech showcases its advanced 3nm UCIe 3.0 technology at the OCP 2025 Global Summit, setting a new standard for chiplet innovation.

InPsytech has successfully taped out its F2F SoIC design under the UCIE 2.0 standard, marking a significant step for high-speed interconnects and 3D heterogeneous integration.

InPsytech proudly joins the Samsung SAFE™ IP Partner Program, enhancing its ONFI and UCIe solutions, boosting innovation in the semiconductor field.

InPsytech has announced its collaboration with Intel Foundry Accelerator to enhance high-performance computing and AI. This partnership aims to improve semiconductor design capabilities.

HSINCHU, July 15, 2025 /PRNewswire/ — InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC’s Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement …