#Microelectronics-based
Dmitry Grigorenko may head the new United Microelectronics Company (based on Sberbank's "Integral Systems") or become Deputy Chairman of Sberbank, overseeing digital. IT oversight in government still undecided. Shadayev to keep Ministry of Digital Development post.
October 20, 2026 at 8:43 AM
The µRepRap project aims to democratize micron-scale fabrication by utilizing accessible materials and 3D-printed components. By leveraging flexure-based designs, the system achieves sub-micron precision, potentially advancing microelectronics and biology.
RepRapMicron (183)
μRepRap - A 3D printer project designed to work at the micron scale - Home · VikOlliver/RepRapMicron Wiki
news.ycombinator.com
October 18, 2026 at 4:54 PM
Coal-derived nanodots helped 2D transistors run at around 0.5 volts, versus advanced silicon’s typical 0.6–0.8 volts. They act as a primer for ultrathin insulating layers. doi.org/hcm2n5
Coal-derived carbon nanodots enable next-generation 2D electronics
Silicon-based microelectronics have powered the digital revolution, but their performance and efficiency are starting to reach limits imposed by the fundamental properties of silicon itself.
techxplore.com
October 9, 2026 at 3:21 PM
A Chinese “smart sex toy” company shipped microchips and over $100,000 in electric motors to Russia, according to a NAKO investigation. The case shows how Russian military supply chains exploit Hong Kong-based firms and loopholes to obtain critical Western microelectronics despite sanctions.
September 21, 2026 at 12:11 PM
Demonstration of on-chip all-optical switching of magnetization in integrated photonics
Dieny, B. et al. Opportunities and challenges for spintronics in the microelectronics industry. Nat. Electron. 3, 446–459 (2020). Nguyen, V. D., Rao, S., Wostyn, K. & Couet, S. Recent progress in spin-orbit torque magnetic random-access memory. NPJ Spintronics 2, 48 (2024). Mishra, P. K., Sravani, M., Bose, A. & Bhuktare, S. Voltage-controlled magnetic anisotropy-based spintronic devices for magnetic memory applications: challenges and perspectives. J. Appl. Phys. 135, 220701 (2024). Parkin, S. & Yang, S.-H. Memory on the racetrack. Nat. Nanotechnol. 10, 195–198 (2015). Ralph, D. & Stiles, M. Spin transfer torques. J. Magn. Magn. Mater. 320, 1190–1216 (2008). Choe, J. Recent technology insights on STT-MRAM: structure, materials, and process integration. In Proc. 2023 IEEE International Memory Workshop (IMW) 1–4 https://doi.org/10.1109/IMW56887.2023.10145822 (IEEE, 2023). Beaurepaire, E., Merle, J.-C., Daunois, A. & Bigot, J.-Y. Ultrafast spin dynamics in ferromagnetic nickel. Phys. Rev. Lett. 76, 4250–4253 (1996). Walowski, J. & Münzenberg, M. Perspective: ultrafast magnetism and THz spintronics. J. Appl. Phys. 120, 140901 (2016). Kimel, A. V. & Li, M. Writing magnetic memory with ultrashort light pulses. Nat. Rev. Mater. 4, 189–200 (2019). Bull, C. et al. Spintronic terahertz emitters: status and prospects from a materials perspective. APL Mater. 9, 090701 (2021). Wang, L...
www.nature.com
September 14, 2026 at 1:01 PM
📢 Ransomware Alert: 🇩🇪

Edacentrum (edacentrum.de), a Germany-based research organization specializing in electronics, semiconductor design, and microelectronics, has reportedly fallen victim to PANZER ransomware.

NB: The group intends to publish the data within 21–22 days.
September 6, 2026 at 11:42 AM
Novosense Microelectronics introduced the NSM350x series, a Hall-based magnetic encoder for robot joints and industrial motion-control systems.

Source: DigiTimes Asia
Novosense encoder launch highlights China's push into robot joint sensing
Chinese analog and mixed-signal chipmaker Novosense Microelectronics has introduced the NSM350x series, a Hall-based magnetic encoder designed for high-precision angular measurement in robot joints and industrial motion-control systems, reports .
www.digitimes.com
August 25, 2026 at 2:38 AM
I recently acquired another Semi-Tech Microelectronics Piped Piper computer. It was not working but after some troubleshooting, it turned out to be a bad Z80 CPU. I don't see that often. It's a portable CP/M based computer with a somewhat unique design. Being Canadian, it's one of my favourites.
December 19, 2024 at 12:46 PM
Infineon Technologies officially opens new R&D centre in Cork

Infineon has stated that the company’s growth will include new senior and junior positions. Global semiconductor, power systems and IoT company Infineon Technologies has officially opened a new Cork-based R&D centre. The new location…
Infineon Technologies officially opens new R&D centre in Cork
Infineon has stated that the company’s growth will include new senior and junior positions. Global semiconductor, power systems and IoT company Infineon Technologies has officially opened a new Cork-based R&D centre. The new location will focus on Infineon’s innovations in the automotive and consumer microelectronics space, in areas such as battery management, motor control and touchscreens.  The premises is supported by the Irish Government through IDA Ireland and Infineon has stated that the continued growth will include new senior and junior positions as well as a strong contingent of local university graduates through the Infineon Ireland graduate programme. 
nexttech-news.com
March 6, 2026 at 7:11 PM
Technologies developed for years growing in major manufacturing, including TSMC:
photonics and spintronics.
phys.org/news/2026-04...
Taming skyrmions: Atom-thin magnets point to ultra-dense, low-power memory
Data is growing at a staggering pace, pushing charge-based microelectronics, such as smartphones and laptops, to their physical limits. Spintronics—technology that uses electron spin rather than charg...
phys.org
April 26, 2026 at 8:10 PM
US charges Hong Kong based-Russian with smuggling military technology to Russia
US charges Hong Kong based-Russian with smuggling military technology to Russia
A Russian man who has lived in Hong Kong has been taken into U.S. custody and charged with smuggling large quantities of American-made, military-grade microelectronics to Russia, the U.S. Department of Justice said on Monday.
www.reuters.com
September 18, 2023 at 10:53 PM
This review examines emerging techniques for producing ultra-thin silicon devices, highlighting #Manufacturing advances, integration strategies and opportunities for next-generation wearable and flexible technologies.

#IJEM #OpenAccess: doi.org/10.1088/2631...
#MaterialsScience #Microelectronics
July 16, 2026 at 2:30 AM
South Korea's 15-Year Semiconductor Roadmap Aims for 0.2nm Chips and 2000-Layer NAND Technology
## Korean Experts Launch 15-Year Semiconductor Advancement Road Map A brand new, far-reaching forecast by South Korea's microelectronics specialists outlines a crucial leap in semiconductor technology in the coming 15 years: The "Semiconductor Technology Roadmap 2026", published by the Korean Society of Semiconductor Engineers, describes the industry's anticipated evolution, including the development of chips based on 0.2-nanometer processes. ### Technological Projections through 2040 In the roadmap, detailed technical forecasts are provided to each sector of microelectronics, carrying its projections from nanometer (nm) technology into angstrom (Å) technologies. * **Logic Chips:** From 2nm Gate-All-Around (GAA) process in current chips such as Exynos 2600, the industry is expected to move to 0.2nm process utilizing next generation CFET transistors in a monolithic 3D structure. * **DRAM:** Technology processes for DRAM are expected to shrink from 11nm to 6nm. * **NAND Flash Memory:** The number of memory layers is estimated to increase by a larger margin going from 321 layers today straight to 2000 layers. * **High Bandwidth Memory(HBM):** HBM is expected to progress from 12-layer stacks to 30 layers with bandwidth extending from 2 TB/s to 128 TB/s. * **AI Processors:** A great leap in performance is envisaged, with capabilities for AI chips going from the present 10 TOPS to 1000 TOPS. ### Purpose and Scope of the Roadmap These documents will serve to boost the long-term competitiveness of the semiconductor industry, motivate academic research, and guide the formulation of human resources development strategies. It delineates the direction for nine key technologies including AI semiconductors, packaging, and quantum computing. The Korean Society of Semiconductor Engineers intends to update and augment this roadmap each year in order to keep up with the fast-moving semiconductor industry. The full roadmap can be accessed from the society's official website.
www.technetbooks.com
January 2, 2026 at 6:31 AM
RAIN Alliance reports on UHF RFID tag shipments #contactless
A total of 52.8bn Ultra High Frequency RAIN RFID tag chips were shipped in 2024, a survey of leading chip suppliers by the RAIN Alliance has found, up 54% in just two years compared to the number shipped in 2022. The data is based on shipment data reported to the association by five leading chip makers — EM Microelectronic, Impinj, NXP, Shanghai Fudan Microelectronics Group and Shanghai Quanray Electronics. “We’re continuing to see strong appetite for RAIN technology across various industries, as reflected by the 52.8bn tag chips shipped in the last 12 months,” Aileen Ryan, president and CEO of the industry association, says. “This is driven by an increase in mandates for a wider range of items to be tagged with RAIN technology – including beauty products, sports equipment and electronics – as well as continued growth in penetration in other industries such as pharmaceuticals, healthcare, logistics and manufacturing. “Emerging use cases will continue to drive future growth, for instance, as businesses increasingly harness and expand their deployments in recognition of the wider sustainability benefits that RAIN can offer. Notable among these is RAIN’s capacity to act as a data carrier that enables compliance with the European Union’s incoming Digital Product Passport regulations.” “With the rollout of RAIN-enabled enterprise mobile devices expected within a few quarters and consumer devices set to follow, we expect the RAIN technology market to continue its upwards trajectory in the coming years,” Ryan adds. “The RAIN Alliance is working to support and accelerate the integration of RAIN technology into mobile devices. We are committed to making RAIN-enabled mobile devices a reality, and enabling new enterprise, consumer and sustainability use cases that will change how we interact with items on a daily basis.”
www.nfcw.com
March 6, 2025 at 3:56 PM
Here you go... which president sold a US semiconductor company, one that specializes in cutting edge custom R&D wafer equipment mind you, to China?

www.reuters.com/article/busi...

I'll hit you up the minute your Fuhrer rips up the CHIPS Act.
U.S. clears Chinese acquisition in rare move
Beijing-based Naura Microelectronics Equipment Co Ltd has completed a deal to buy U.S. semiconductor manufacturing equipment company Akrion Systems LLC, in a rare instance of the U.S. government appro...
www.reuters.com
November 27, 2025 at 12:46 AM
[3/4] based on the project implementation progress. This procurement can improve the efficiency of Guangxin Microelectronics' procurement management and reduce comprehensive procurement costs. However, the execution of the contract is affected by factors such as force majeure and there
June 10, 2026 at 11:40 AM
[3/4] based on the project implementation progress. This procurement can improve the efficiency of Guangxin Microelectronics' procurement management and reduce comprehensive procurement costs. However, the execution of the contract is affected by factors such as force majeure and there
June 10, 2026 at 11:33 AM
[3/4] based on the project implementation progress. This procurement can improve the efficiency of Guangxin Microelectronics' procurement management and reduce comprehensive procurement costs. However, the execution of the contract is affected by factors such as force majeure and there
June 10, 2026 at 11:32 AM
[3/4] based on the project implementation progress. This procurement can improve the efficiency of Guangxin Microelectronics' procurement management and reduce comprehensive procurement costs. However, the execution of the contract is affected by factors such as force majeure and there
June 10, 2026 at 11:30 AM
[2/3] Department, and his team visited Fudan Microelectronics Group for a visit and exchange. This visit laid a good foundation for both parties to deepen industrial interaction and explore cooperation mechanisms. Based on the consensus on the development path of AI-driven
June 10, 2026 at 11:28 AM
[2/3] Department, and his team visited Fudan Microelectronics Group for a visit and exchange. This visit laid a good foundation for both parties to deepen industrial interaction and explore cooperation mechanisms. Based on the consensus on the development path of AI-driven
June 10, 2026 at 11:28 AM
[2/3] Department, and his team visited Fudan Microelectronics Group for a visit and exchange. This visit laid a good foundation for both parties to deepen industrial interaction and explore cooperation mechanisms. Based on the consensus on the development path of AI-driven
June 10, 2026 at 11:28 AM