Full research note for extremely thermal resistant 3d microchip architecture gist.github.com #### https://gist.github.com/madmoo-Pi/6eba9aa53c095874bb1974461a73d9cc ##### Self-assembling 3D honeycomb compute architecture using acoustic levitation + magnetic alignment. SiC Dy hex units fused via pulsed electroplating. Designed for human welfare, not datacenters. #OpenSilicon #ForHumanity This is a design for self assembling 3d microchips that can be configured to use and are at the extreme of thermal limits , I had the design and the what to do DeepSeek R1 brought the science , hopefully this has real world applications 1 https://gist.github.com/madmoo-Pi/f31aaea7089e942a27223770a5361c89 Core theory 2 https://gist.github.com/madmoo-Pi/907f304729f64f6d61bf1fda0e1748a7 This file has been truncated. show original

While the resulting SDR won't be winning any awards for performance or features, it's a great example of Tiny Tapeout's flexibility.