#TO247
One cut. One step closer to a finished power device.
Here’s a look at the lead trimming process for our TO-247 discrete power devices.
Precision in every step matters.
#TO247 #PowerSemiconductor #PowerElectronics #SemiconductorPackaging #IGBT #MOSFET #SemiconductorManufacturing
September 24, 2026 at 9:05 AM
I submitted an abstract to #ipec2026 #ecceasia on lowering the transistor switching losses in a standard TO247 package.

We have already maxed out silicon performance and we almost maxed out SiC on a semiconductor level. But we still can influence their performance by changing how we package and […]
Original post on en.osm.town
en.osm.town
October 30, 2025 at 10:28 AM
Infineon prepares DTO247-packaged IGBTs

Infineon is developing TRENCHSTOP H7 IGBTs in a DTO247 package, which is twice the size of a standard TO247.
Infineon prepares DTO247-packaged IGBTs
Infineon is developing TRENCHSTOP H7 IGBTs in a DTO247 package, which is twice the size of a standard TO247.
www.edn.com
April 3, 2025 at 5:02 PM
May 4, 2026 at 4:19 PM