Here’s a look at the lead trimming process for our TO-247 discrete power devices.
Precision in every step matters.
#TO247 #PowerSemiconductor #PowerElectronics #SemiconductorPackaging #IGBT #MOSFET #SemiconductorManufacturing
Here’s a look at the lead trimming process for our TO-247 discrete power devices.
Precision in every step matters.
#TO247 #PowerSemiconductor #PowerElectronics #SemiconductorPackaging #IGBT #MOSFET #SemiconductorManufacturing
We have already maxed out silicon performance and we almost maxed out SiC on a semiconductor level. But we still can influence their performance by changing how we package and […]
Infineon is developing TRENCHSTOP H7 IGBTs in a DTO247 package, which is twice the size of a standard TO247.
Infineon is developing TRENCHSTOP H7 IGBTs in a DTO247 package, which is twice the size of a standard TO247.
#epsteinweb #efta00621219
https://epsteinweb.org
Available in the iOS app store now!
https://apps.apple.com/us/app/epstein-web/id6758880661
#epsteinweb #efta00621219
https://epsteinweb.org
Available in the iOS app store now!
https://apps.apple.com/us/app/epstein-web/id6758880661