And what about PS2 with 32 MB RAM with 4 MB of eDRAM. Vice City and Silent Hill were crazy impressive.
June 25, 2026 at 8:36 PM
And what about PS2 with 32 MB RAM with 4 MB of eDRAM. Vice City and Silent Hill were crazy impressive.
There was a time when the Xbox 360 10MB eDRAM felt like Microsoft's biggest hardware mistake.
Somehow, they've managed to top it.
Somehow, they've managed to top it.
The fucking head of fucking XBox Graphics used a fucking "AI" slop image to hire new engineers but couldn't tell that the fucking screen on the fucking monitor is facing backwards.
July 13, 2025 at 9:42 AM
There was a time when the Xbox 360 10MB eDRAM felt like Microsoft's biggest hardware mistake.
Somehow, they've managed to top it.
Somehow, they've managed to top it.
The Xbox 360 GPU was also quite lopsided.
You had 10MB of absurdly fast eDRAM. Tile the screen into chunks correctly, and you got some antialiasing for “free” (MSAA).
The PS3 had to blur the entire scene to smooth edges (QAA). Hence some Xbox games looking cleaner.
You had 10MB of absurdly fast eDRAM. Tile the screen into chunks correctly, and you got some antialiasing for “free” (MSAA).
The PS3 had to blur the entire scene to smooth edges (QAA). Hence some Xbox games looking cleaner.
October 15, 2025 at 8:44 PM
The Xbox 360 GPU was also quite lopsided.
You had 10MB of absurdly fast eDRAM. Tile the screen into chunks correctly, and you got some antialiasing for “free” (MSAA).
The PS3 had to blur the entire scene to smooth edges (QAA). Hence some Xbox games looking cleaner.
You had 10MB of absurdly fast eDRAM. Tile the screen into chunks correctly, and you got some antialiasing for “free” (MSAA).
The PS3 had to blur the entire scene to smooth edges (QAA). Hence some Xbox games looking cleaner.
Apple SOCs do not use eDRAM, which is DRAM manufactured on the same silicon die as a logic circuit (e.g. CPUs).
AFAIK, Apple uses various technologies to integrate separately manufactured DRAM dies into/onto the same *package*.
So it's a separately sourced due even if physically integrated.
AFAIK, Apple uses various technologies to integrate separately manufactured DRAM dies into/onto the same *package*.
So it's a separately sourced due even if physically integrated.
June 28, 2026 at 8:30 PM
Apple SOCs do not use eDRAM, which is DRAM manufactured on the same silicon die as a logic circuit (e.g. CPUs).
AFAIK, Apple uses various technologies to integrate separately manufactured DRAM dies into/onto the same *package*.
So it's a separately sourced due even if physically integrated.
AFAIK, Apple uses various technologies to integrate separately manufactured DRAM dies into/onto the same *package*.
So it's a separately sourced due even if physically integrated.
October 19, 2023 at 9:49 AM
I worked at Intel on the development of the eDRAM manufacturing process that was used starting in 2013 to build high-bandwidth L4 cache/video memory for Iris Pro integrated graphics.
It's very different from DRAM-only manufacturing processes.
ieeexplore.ieee.org/iel7/6571719...
It's very different from DRAM-only manufacturing processes.
ieeexplore.ieee.org/iel7/6571719...
June 28, 2026 at 8:34 PM
I worked at Intel on the development of the eDRAM manufacturing process that was used starting in 2013 to build high-bandwidth L4 cache/video memory for Iris Pro integrated graphics.
It's very different from DRAM-only manufacturing processes.
ieeexplore.ieee.org/iel7/6571719...
It's very different from DRAM-only manufacturing processes.
ieeexplore.ieee.org/iel7/6571719...
This is a Xenon motherboard with a replaced GPU (Elpis). You can see sticker that indicates this, and he eDRAM part of the GPU is square instead of rectangular, and the revision also indicates the Elpis revision. Elpis GPUs attempted to solve the infamous RRoD or earlier revisions.
June 13, 2026 at 7:59 PM
This is a Xenon motherboard with a replaced GPU (Elpis). You can see sticker that indicates this, and he eDRAM part of the GPU is square instead of rectangular, and the revision also indicates the Elpis revision. Elpis GPUs attempted to solve the infamous RRoD or earlier revisions.
In this paper, researchers have presented a 3D-integrated, memory-on-memory SRAM-eDRAM hybrid CIM architecture, implemented in 22FDX technology, capable of performing general matrix operations directly within the memory crossbar with 4-bit precision.
arxiv.org/pdf/2604.13969
arxiv.org/pdf/2604.13969
April 16, 2026 at 4:17 PM
In this paper, researchers have presented a 3D-integrated, memory-on-memory SRAM-eDRAM hybrid CIM architecture, implemented in 22FDX technology, capable of performing general matrix operations directly within the memory crossbar with 4-bit precision.
arxiv.org/pdf/2604.13969
arxiv.org/pdf/2604.13969
y'know how everyone is going mental with AMDs 3D-VCache? gluing a huge 64MB cache on top of the CPU = performance
I remember when Intel was doing eDRAM in Broadwell. A separate chip with 128MB cache to provide high bandwidth (50GB/s, very fast at the time) for the iGPU.
I remember when Intel was doing eDRAM in Broadwell. A separate chip with 128MB cache to provide high bandwidth (50GB/s, very fast at the time) for the iGPU.
July 28, 2025 at 4:36 AM
y'know how everyone is going mental with AMDs 3D-VCache? gluing a huge 64MB cache on top of the CPU = performance
I remember when Intel was doing eDRAM in Broadwell. A separate chip with 128MB cache to provide high bandwidth (50GB/s, very fast at the time) for the iGPU.
I remember when Intel was doing eDRAM in Broadwell. A separate chip with 128MB cache to provide high bandwidth (50GB/s, very fast at the time) for the iGPU.
This week's roundup of news covers a range of topics, including #robotcontrol, #WiSUN Low Energy Certification, and Nano IC's A14 Logic and #eDRAM #ProcessDesignKits.
Robot Control, Wi-SUN Low Energy Certification: Embedded Week Insights
Here’s a roundup of this week’s must-read articles. We cover the latest developments on Nano IC's A14 Logic and eDRAM PDKs, the Wi-SUN FAN 1.1 LE Certification, and Emerson's new LabVIEW+ Suite capabilities. Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website. NEWS and ARTICLES Emerson Updates NI Nigel AI and Expands LabVIEW+ Suite Capabilities…
www.embedded.com
February 7, 2026 at 4:21 AM
This week's roundup of news covers a range of topics, including #robotcontrol, #WiSUN Low Energy Certification, and Nano IC's A14 Logic and #eDRAM #ProcessDesignKits.
I got Hexic to compile by stubbing all those Kernel calls. I don't think any of them are necessary since they seem related to initializing hardware components such as EDRAM or displaying UIs. No real implementations exist in Xenia i don't think
February 21, 2026 at 12:42 AM
I got Hexic to compile by stubbing all those Kernel calls. I don't think any of them are necessary since they seem related to initializing hardware components such as EDRAM or displaying UIs. No real implementations exist in Xenia i don't think
I haven't worked directly on leading-edge semi processes for a decade now, so my inside knowledge is getting rusty… but as I understand it, the package-level integration technologies and die-stacking have gotten SO ADVANCED that eDRAM is no longer very competitive.
(Intel discont'ed it too.)
(Intel discont'ed it too.)
June 28, 2026 at 9:09 PM
I haven't worked directly on leading-edge semi processes for a decade now, so my inside knowledge is getting rusty… but as I understand it, the package-level integration technologies and die-stacking have gotten SO ADVANCED that eDRAM is no longer very competitive.
(Intel discont'ed it too.)
(Intel discont'ed it too.)
I didn't really get this but while going through the wikipedia page I came across this little line here and that's when I started giggling.
April 6, 2026 at 3:34 PM
I didn't really get this but while going through the wikipedia page I came across this little line here and that's when I started giggling.
Console Thursday
PlayStation 2 🟦 📀
- Release: March 2000
- Sony
- Emotion Engine
- 6.2 Gigaflops Graphics
- 32 MB (RDRAM) / 4 GB (eDRAM)
- 155+ Million Units Sold
#ps2 #videogames #history
PlayStation 2 🟦 📀
- Release: March 2000
- Sony
- Emotion Engine
- 6.2 Gigaflops Graphics
- 32 MB (RDRAM) / 4 GB (eDRAM)
- 155+ Million Units Sold
#ps2 #videogames #history
May 30, 2024 at 6:01 PM
Console Thursday
PlayStation 2 🟦 📀
- Release: March 2000
- Sony
- Emotion Engine
- 6.2 Gigaflops Graphics
- 32 MB (RDRAM) / 4 GB (eDRAM)
- 155+ Million Units Sold
#ps2 #videogames #history
PlayStation 2 🟦 📀
- Release: March 2000
- Sony
- Emotion Engine
- 6.2 Gigaflops Graphics
- 32 MB (RDRAM) / 4 GB (eDRAM)
- 155+ Million Units Sold
#ps2 #videogames #history
Will be interesting to hear if there is anything to DCA1! I've got a DCA2 awaiting some kind of benchmarking; it requires special 15ns EDRAM SIMMs in the first two slots, with the others for regular uncached FPM stuff. The Ramtron EDRAM chips are apparently a 35ns DRAM combined with 15ns SRAM cache.
January 14, 2025 at 3:38 AM
Will be interesting to hear if there is anything to DCA1! I've got a DCA2 awaiting some kind of benchmarking; it requires special 15ns EDRAM SIMMs in the first two slots, with the others for regular uncached FPM stuff. The Ramtron EDRAM chips are apparently a 35ns DRAM combined with 15ns SRAM cache.
I'm trying to find the original Xbox 360 press release for work and wouldn't it have been great if it was just this ukstories.microsoft.com/features/xbo...
Xbox 360 is launched - Microsoft UK Stories
New controller 3.2 GHz IBM PowerPC tri-core CPU codenamed “Xenon” 500 MHz ATi custom Radeon X1800 DirectX 9.0c based GPU codenamed “Xenos” 512 MB of GDDR3 RAM @ 700 MHz 22.4 GB/s, 10 MB EDRAM GPU fram...
ukstories.microsoft.com
September 19, 2024 at 9:51 AM
I'm trying to find the original Xbox 360 press release for work and wouldn't it have been great if it was just this ukstories.microsoft.com/features/xbo...
The proposed 3D stacking of SRAM and eDRAM employs monolithic 3D integration, enabling fine-pitch intertier connections, supporting high-speed digital-to-analog and analog-to-digital interactions while maintaining high density and low parasitics.
April 16, 2026 at 4:17 PM
The proposed 3D stacking of SRAM and eDRAM employs monolithic 3D integration, enabling fine-pitch intertier connections, supporting high-speed digital-to-analog and analog-to-digital interactions while maintaining high density and low parasitics.
IEEE Solid-State Circuits Magazine:
SRAM- and eDRAM-Based Compute-in-Memory Designs, Accelerators, and Evaluation Frameworks: Macro-Level and System-Level Optimization and Evaluation
Yifan He; Xiaofeng Hu; Hongyang Jia; Jae-sun Seo
Read here: https://bit.ly/4h1sqWl
SRAM- and eDRAM-Based Compute-in-Memory Designs, Accelerators, and Evaluation Frameworks: Macro-Level and System-Level Optimization and Evaluation
Yifan He; Xiaofeng Hu; Hongyang Jia; Jae-sun Seo
Read here: https://bit.ly/4h1sqWl
October 13, 2025 at 12:00 PM
IEEE Solid-State Circuits Magazine:
SRAM- and eDRAM-Based Compute-in-Memory Designs, Accelerators, and Evaluation Frameworks: Macro-Level and System-Level Optimization and Evaluation
Yifan He; Xiaofeng Hu; Hongyang Jia; Jae-sun Seo
Read here: https://bit.ly/4h1sqWl
SRAM- and eDRAM-Based Compute-in-Memory Designs, Accelerators, and Evaluation Frameworks: Macro-Level and System-Level Optimization and Evaluation
Yifan He; Xiaofeng Hu; Hongyang Jia; Jae-sun Seo
Read here: https://bit.ly/4h1sqWl
=>
Intel: Gain Cell eDRAM
Space-Efficient 3T (Nov 2022) patents.google.com/patent/US202...
2T1C (Ferroelectric C) (Sep 2022) patents.google.com/patent/US202...
2T0C (Low temp) (Jul 2022) patents.google.com/patent/US202...
2T1C (2 Stacked TFTs), Feb 2025 (Sep 2018) patents.google.com/patent/US122...
Intel: Gain Cell eDRAM
Space-Efficient 3T (Nov 2022) patents.google.com/patent/US202...
2T1C (Ferroelectric C) (Sep 2022) patents.google.com/patent/US202...
2T0C (Low temp) (Jul 2022) patents.google.com/patent/US202...
2T1C (2 Stacked TFTs), Feb 2025 (Sep 2018) patents.google.com/patent/US122...
August 7, 2026 at 2:24 PM
=>
Intel: Gain Cell eDRAM
Space-Efficient 3T (Nov 2022) patents.google.com/patent/US202...
2T1C (Ferroelectric C) (Sep 2022) patents.google.com/patent/US202...
2T0C (Low temp) (Jul 2022) patents.google.com/patent/US202...
2T1C (2 Stacked TFTs), Feb 2025 (Sep 2018) patents.google.com/patent/US122...
Intel: Gain Cell eDRAM
Space-Efficient 3T (Nov 2022) patents.google.com/patent/US202...
2T1C (Ferroelectric C) (Sep 2022) patents.google.com/patent/US202...
2T0C (Low temp) (Jul 2022) patents.google.com/patent/US202...
2T1C (2 Stacked TFTs), Feb 2025 (Sep 2018) patents.google.com/patent/US122...
The ~280GB/s from the edram could keep the gpu saturated so effectively that they were getting 4xMSAA at 720p for free. With like 30% more memory bandwidth it'd do 1080. It was basically the last chopper out before everyone collectively gave up on visual clarity and embraced temporal antialiasing
August 25, 2026 at 11:13 PM
The ~280GB/s from the edram could keep the gpu saturated so effectively that they were getting 4xMSAA at 720p for free. With like 30% more memory bandwidth it'd do 1080. It was basically the last chopper out before everyone collectively gave up on visual clarity and embraced temporal antialiasing
Looking at the DCA1 manual, I *think* that board just uses regular ram (guess the need for EDRAM is new to DCA2?). Instead it sounds like the DCA1 is doing something weird with memory writes to try and make them fast enough to make cache on the motherboard unnecessary - in theory.
January 14, 2025 at 8:24 AM
Looking at the DCA1 manual, I *think* that board just uses regular ram (guess the need for EDRAM is new to DCA2?). Instead it sounds like the DCA1 is doing something weird with memory writes to try and make them fast enough to make cache on the motherboard unnecessary - in theory.
It's a shame DDR3 memory was such dogshit. The Wii U has such a neat processor/gpu combo, the 32MB of eDRAM for the gpu is like an ancient predecessor to rdna infinity fabric. If it were possible to swap to "nice" modern 2133 modules w/ tighter timings, maybe even double to 4gb, it'd be p fast
August 25, 2026 at 11:03 PM
It's a shame DDR3 memory was such dogshit. The Wii U has such a neat processor/gpu combo, the 32MB of eDRAM for the gpu is like an ancient predecessor to rdna infinity fabric. If it were possible to swap to "nice" modern 2133 modules w/ tighter timings, maybe even double to 4gb, it'd be p fast
L'exploit de la 360 me permet aussi de connaître de manière plus concrète les effets du delid que j'avais fait cet été.
Les températures sont excellentes (après une session de jeu) ❄️
Les températures sont excellentes (après une session de jeu) ❄️
March 16, 2025 at 10:58 PM
L'exploit de la 360 me permet aussi de connaître de manière plus concrète les effets du delid que j'avais fait cet été.
Les températures sont excellentes (après une session de jeu) ❄️
Les températures sont excellentes (après une session de jeu) ❄️
September 10, 2026 at 5:12 PM