Semiconductor M&A has been humming. One of the next deals could be for Eliyan, whose technology allows separate chips inside an AI system to talk to one another more quickly and efficiently.The five-y...

Semiconductor M&A has been humming. One of the next deals could be for Eliyan, whose technology allows separate chips inside an AI system to talk to one another more quickly and efficiently.The five-y...

AI chiplet startup Eliyan has received at least one takeover bid and hired a bank, with a potential $3 billion target after a $1 billion raise. The post AI chiplet startup Eliyan draws takeover interest months after $1 billion valuation appeared first on Crypto Briefing.

Semiconductor M&A has been humming. One of the next deals could be for Eliyan, whose technology allows separate chips inside an AI system to talk to one another more quickly and efficiently.The five-y...

Eliyan, a five-year-old networking startup, has received a takeover bid and is working with an investment bank to target a $3 billion valuation.

Stephen Nellis / Reuters: Eliyan, which aims to license tech and make physical “chiplets” to ease AI chip data transfer bottlenecks, raised a $145M Series C at a $1B valuation — Eliyan, a startup that aims to ease the bottlenecks in transferring data between AI chips in data centers …

Das US-amerikanische Halbleiterunternehmen Eliyan hat am 29. Juli 2026 den Abschluss seiner Series-C-Finanzierungsrunde bekannt gegeben. Mit der Aufnahme von 145 Millionen US-Dollar an neuem Kapital erreicht das Unternehmen eine Bewertung von einer Milliarde US-Dollar und erlangt damit den sogenannten Unicorn-Status. Die Finanzspritze soll insbesondere die Entwicklung hochleistungsfähiger Interconnect-Technologien für Künstliche Intelligenz (KI) in Rechenzentren beschleunigen.Strategische […] The post Eliyan erreicht Unicorn-Status: 145 Millionen für KI-Chip-Technologie appeared first on BornCity.

Stephen Nellis / Reuters: Eliyan, which aims to license tech and make physical “chiplets” to ease AI chip data transfer bottlenecks, raised a $145M Series C at a $1B valuation  —  Eliyan, a startup that aims to ease the bottlenecks in transferring data between AI chips in data centers …

[더구루=정예린 기자] 미국 반도체 설계자산(IP) 업체 '엘리얀(Eliyan)'이 삼성전자 파운드리(반도체 위탁생산)를 통해 고대역폭메모리(HBM)를 위한 새로운 설계 상용화에 성공했다. 삼성전자가 고성능 칩 생산을 위한 파운드리 역량을 인정받으며 고객사 풀을 넓혀가고 있다. 엘리얀은 20일(현지시간) 삼성 파운드리 4나노 공정(SF4X)에서 물리계층(P

Eliyan Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today revealed the successful delivery of first silicon for its NuLink -2.0 PHY, manufactured in a 3 nm process. The device achieves 64 Gbps/bump, the industry's highest performance for a die-to-die PHY solution for multi-die architectures. While compatible with UCIe standard, the milestone further confirms Eliyan's ability to extend die-to-die connectivity by 2x higher bandwidth, on standard as well as advanced packaging, at unprecedented power, area, and latency. The NuLink-2.0 is a multi-mode PHY solution that also supports UMI (Universal Memory Interconnect), a novel chiplet interconnect technology that improves Die-to-Memory bandwidth efficiency by more than 2x. UMI leverages a dynamic bidirectional PHY whose specifications are currently being finalized with the Open Compute Project (OCP) as BoW 2.1. Read full story