* SK HYNIX CEO: TO BEGIN VOLUME PRODUCTION OF NEXT-GENERATION HBM4E CHIPS AT INDIANA FACILITY IN H2 2029
@reuters.com #$SKHY
@reuters.com #$SKHY
August 27, 2026 at 3:11 PM
* SK HYNIX CEO: TO BEGIN VOLUME PRODUCTION OF NEXT-GENERATION HBM4E CHIPS AT INDIANA FACILITY IN H2 2029
@reuters.com #$SKHY
@reuters.com #$SKHY
Samsung to Double HBM4 and HBM4E Capacity in 2027 Amid Strong Demand
www.techpowerup.com
September 21, 2026 at 12:15 PM
TSMC on HBM4 and C-HBM4E
HBM4:
- N12 base die
- 0.8 V Vdd
C-HBM4E:
- N3P base die
- 0.75 V Vdd
- memory controller inside base die
www.hardwareluxx.de/index.php/ne...
HBM4:
- N12 base die
- 0.8 V Vdd
C-HBM4E:
- N3P base die
- 0.75 V Vdd
- memory controller inside base die
www.hardwareluxx.de/index.php/ne...
November 26, 2025 at 1:59 PM
TSMC on HBM4 and C-HBM4E
HBM4:
- N12 base die
- 0.8 V Vdd
C-HBM4E:
- N3P base die
- 0.75 V Vdd
- memory controller inside base die
www.hardwareluxx.de/index.php/ne...
HBM4:
- N12 base die
- 0.8 V Vdd
C-HBM4E:
- N3P base die
- 0.75 V Vdd
- memory controller inside base die
www.hardwareluxx.de/index.php/ne...
Samsung starts HBM4E sampling with 16Gbps speed and 48GB stacks
Samsung starts HBM4E sampling with 16Gbps speed and 48GB stacks - VideoCardz.com
Samsung HBM4E samples now shipping to major customers Samsung has started shipping 12-layer HBM4E samples to major global customers. The company says this
videocardz.com
May 30, 2026 at 8:37 AM
Samsung starts HBM4E sampling with 16Gbps speed and 48GB stacks
Samsung sets its next-gen memory milestones with HBM4e reaching 13 Gbps per stack
Samsung sets its next-gen memory milestones with HBM4e reaching 13 Gbps per stack - VideoCardz.com
Samsung aims for 13Gbps HBM4e Samsung HBM4E plans (AI Upscaled), Source: SEDaily A lot had changed since AMD began fusing HBM into its products. While it did not help AMD win the enthusiast market, it...
videocardz.com
October 16, 2025 at 8:01 AM
Samsung sets its next-gen memory milestones with HBM4e reaching 13 Gbps per stack
Samsung is expected to more than double HBM4 and HBM4E output next year, based on a 2.5-fold increase in demand for glass carriers. The company plans to boost outsourced cleaning of these essential wafer thinning components from 20,000 to 50,000 sheets monthly.
September 21, 2026 at 7:14 PM
Samsung is expected to more than double HBM4 and HBM4E output next year, based on a 2.5-fold increase in demand for glass carriers. The company plans to boost outsourced cleaning of these essential wafer thinning components from 20,000 to 50,000 sheets monthly.
Intel Jaguar Shores reportedly set to use HBM4E memory
Intel Jaguar Shores reportedly set to use HBM4E memory - VideoCardz.com
Next-Gen Gaudi successor to use HBM4E Leaker claims Intel Jaguar Shores may jump to HBM4E, not HBM4 Intel's next data center accelerator platform, Jaguar
videocardz.com
December 28, 2025 at 8:27 PM
Intel Jaguar Shores reportedly set to use HBM4E memory
That Rubin Ultra package will be huuuuuge. Four times a reticle-sized GPU plus 16 HBM4E stacks.
March 18, 2025 at 8:00 PM
That Rubin Ultra package will be huuuuuge. Four times a reticle-sized GPU plus 16 HBM4E stacks.
Samsung Targets 13 Gbps HBM4e, Posts $8.5 Billion Q3 Operating Profit
www.techpowerup.com
October 15, 2025 at 11:29 AM
HBM5 aims for double HBM4E performance
Samsung teased HBM5, targeting double HBM4E performance and 20% better power efficiency.
This could mean a 4,096-bit interface for future AI accelerators.
Samsung teased HBM5, targeting double HBM4E performance and 20% better power efficiency.
This could mean a 4,096-bit interface for future AI accelerators.
September 3, 2026 at 8:42 AM
HBM5 aims for double HBM4E performance
Samsung teased HBM5, targeting double HBM4E performance and 20% better power efficiency.
This could mean a 4,096-bit interface for future AI accelerators.
Samsung teased HBM5, targeting double HBM4E performance and 20% better power efficiency.
This could mean a 4,096-bit interface for future AI accelerators.
Samsung to Double HBM4 and HBM4E Capacity in 2027 Amid Strong Demand
Samsung is reportedly increasing its orders for materials to boost high-bandwidth memory (HBM) production, with plans to...
🔗 https://www.madshrimps.be/news/samsung-to-double-hbm4-and-hbm4e-capacity-in-2027-amid-strong-demand/
Samsung is reportedly increasing its orders for materials to boost high-bandwidth memory (HBM) production, with plans to...
🔗 https://www.madshrimps.be/news/samsung-to-double-hbm4-and-hbm4e-capacity-in-2027-amid-strong-demand/
September 22, 2026 at 6:11 AM
Samsung to Double HBM4 and HBM4E Capacity in 2027 Amid Strong Demand
Samsung is reportedly increasing its orders for materials to boost high-bandwidth memory (HBM) production, with plans to...
🔗 https://www.madshrimps.be/news/samsung-to-double-hbm4-and-hbm4e-capacity-in-2027-amid-strong-demand/
Samsung is reportedly increasing its orders for materials to boost high-bandwidth memory (HBM) production, with plans to...
🔗 https://www.madshrimps.be/news/samsung-to-double-hbm4-and-hbm4e-capacity-in-2027-amid-strong-demand/
SK hynix ships 12-layer HBM4E samples with 16 Gbps per pin speed
SK hynix ships 12-layer HBM4E samples with 16 Gbps per pin speed - VideoCardz.com
SK hynix has started shipping samples of its next-generation HBM4E memory to major customers.
videocardz.com
June 18, 2026 at 7:47 AM
SK hynix ships 12-layer HBM4E samples with 16 Gbps per pin speed
Samsung Electronics ships faster HBM4E chip samples to customers; shares jump reut.rs/49nE77u
Samsung Electronics ships faster HBM4E chip samples to customers; shares jump
Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
reut.rs
May 29, 2026 at 3:40 AM
Samsung Electronics ships faster HBM4E chip samples to customers; shares jump reut.rs/49nE77u
Samsung Reportedly to Use 2 nm Process on HBM4E Base Die
www.techpowerup.com
March 12, 2026 at 3:43 PM
NVIDIA unveils Rubin Ultra with 1TB HBM4e memory for 2027, Feynman architecture in 2028
NVIDIA unveils Rubin Ultra with 1TB HBM4e memory for 2027, Feynman architecture in 2028 - VideoCardz.com
Rubin Ultra and Feynman announced NVIDIA has revealed its new GPU chips and new GPU architectures at GTC 2025. We knew updates to NVIDIA’s data-center portfolio were to be expected, as GTC 2025 is NVIDIA’s...
videocardz.com
March 18, 2025 at 8:01 PM
NVIDIA unveils Rubin Ultra with 1TB HBM4e memory for 2027, Feynman architecture in 2028
Samsung is expected to more than double output of its HBM4 and HBM4E DRAM
View Article | Discussion + AI Summary
Summary of HN discussion 🧵👇
View Article | Discussion + AI Summary
Summary of HN discussion 🧵👇
Samsung to Double HBM4 Output Next Year, Sources Say
Samsung Electronics is set to more than double HBM4 and HBM4E output next year, lifting glass carrier demand 2.5-fold, industry sources said.
en.sedaily.com
September 21, 2026 at 2:00 AM
Samsung is expected to more than double output of its HBM4 and HBM4E DRAM
View Article | Discussion + AI Summary
Summary of HN discussion 🧵👇
View Article | Discussion + AI Summary
Summary of HN discussion 🧵👇
Samsung unveils HBM4E memory chip for future AI supercomputers. Read more about it in our article linked below. ⏬
#GTC2026 #HBM4E
#GTC2026 #HBM4E
Samsung unveils HBM4E memory chip for future AI supercomputers
At the NVIDIA GTC 2026 event in San Jose, California, Samsung showcased its HBM4E memory chip for the first time.
www.sammobile.com
March 17, 2026 at 9:06 AM
Samsung says it has started shipping its first 12-layer HBM4E samples to major clients; SK Hynix said in April that it aimed to ship HBM4E samples in H2 2026 (Yoolim Lee/Bloomberg)
Main Link | Techmeme Permalink
Main Link | Techmeme Permalink
May 29, 2026 at 5:01 AM
Samsung says it has started shipping its first 12-layer HBM4E samples to major clients; SK Hynix said in April that it aimed to ship HBM4E samples in H2 2026 (Yoolim Lee/Bloomberg)
Main Link | Techmeme Permalink
Main Link | Techmeme Permalink
Global Unichip Corp announced that its HBM4E PHY and Controller IP is design ready and has been adopted in customer AI ASICs.
Source: EE Times
Source: EE Times
GUC Announces 2nm 16 Gbps HBM4E IP
Global Unichip Corp announced that its HBM4E PHY and Controller IP is design ready and has been adopted in customer AI ASICs.
www.eetimes.com
September 22, 2026 at 2:13 PM
Global Unichip Corp announced that its HBM4E PHY and Controller IP is design ready and has been adopted in customer AI ASICs.
Source: EE Times
Source: EE Times
TSMC Showcases Custom C-HBM4E, N3P Logic Dies Target Double Efficiency
www.techpowerup.com
December 1, 2025 at 7:01 PM
[PR] Samsung Unveils HBM4E Solutions at NVIDIA GTC 2026
www.techpowerup.com
March 16, 2026 at 9:41 PM
[PR] Rambus Announces Its New HBM4E Memory Controller IP
www.techpowerup.com
March 4, 2026 at 10:56 PM
Samsung becomes the world's first company to ship HBM4E chip samples to customers and is fully ready to lead the HBM segment amid the booming AI market. #HBM4E
Samsung becomes world's first to ship HBM4E chip samples
Samsung has announced that it has started shipping HBM4E memory chip samples to customers, becoming the world's first brand to do so.
www.sammobile.com
May 29, 2026 at 4:24 AM
Samsung becomes the world's first company to ship HBM4E chip samples to customers and is fully ready to lead the HBM segment amid the booming AI market. #HBM4E