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shysemi.bsky.social
One cut. One step closer to a finished power device.
Here’s a look at the lead trimming process for our TO-247 discrete power devices.
Precision in every step matters.
#TO247 #PowerSemiconductor #PowerElectronics #SemiconductorPackaging #IGBT #MOSFET #SemiconductorManufacturing
September 24, 2026 at 9:05 AM
jissonews.bsky.social
12月2日(水)10:00-17:15に、化学工学会エレクトロニクス部会が2026年度先端技術シンポジウム「ガラス基板が拓く次世代半導体パッケージング ～ ガラスコア基板・インターポーザの最新動向と実用化への最前線 ～」を開催。講演7件。 ガラスサブストレートの実用化・グローバルトレンド、パッケージング用ガラス基板の基礎と応用、など。終了後に技術交流会を予定。東京都千代田区・レゾナック イノベーションセンターおよびオンラインにて。詳細は https://x.gd/Jgmyt に。
#Seminar #SCEJ #GlassSubstrate #SemiconductorPackaging
September 25, 2026 at 4:25 AM
asianewstoday.bsky.social
Tomocube Launches HT-T1 Desktop for 3D Glass Substrate Defect Analysis in Advanced Packaging #3DAnalysis #DefectAnalysis #SemiconductorPackaging #AdvancedPackaging #NonDestructiveTesting
Tomocube Launches HT-T1 Desktop for 3D Glass Substrate Defect Analysis in Advanced Packaging
Provides non-destructive 3D analysis of the location, morphology, and depth profile of internal defects in glass substrates Introduces TAMI, a dedicated 3D analysis software platform that connects R&D analysis with production-line review Accelerates root-cause analysis and yield learning for glass substrates, a key material for next-generation advanced packaging DAEJEON, South Korea, July 13, 2026 /PRNewswire/ — Tomocube, a 3D non-destructive inspection and metrology company, today announced the launch of HT-T1 Desktop (HT-T1D), a desktop holotomography system for high-resolution 3D defect analysis of glass substrates used in next-generation semiconductor packaging. HT-T1D is optimized for glass-substrate inspection and metrology workflows. When conventional […]
dlvr.it
July 13, 2026 at 1:11 PM
gauravpatilll.bsky.social
Revolutionize miniaturization with the Embedded Die Packaging Technology Market 🧩📦! Explore advanced packaging trends boosting performance, speed & efficiency in electronics. #EmbeddedDie #SemiconductorPackaging #TechInnovation ⚙️📈
Global Embedded Die Packaging Technology Market Insights 2023, Analysis And Forecast To 2030, By Platform, By Industry Vertical
Global Embedded Die Packaging Technology Market, Share, Revenue, Size, Global, Research Report, Rate, Price, Industry Trends, Analysis, Outlook ,Forecast,
www.statsandresearch.com
July 4, 2025 at 10:23 AM
citcnetherlands.bsky.social
🧪Last week, the practical week of the Semiconductor Packaging University Program took place. Three eager students worked in our labs and learned that dies can actually fly. Their efforts were rewarded with a well-deserved certificate.
#accesstoeducation #semiconductorpackaging
Three young men standing in front of a screen showing 'CITC Semiconductor Packaging University Program'. In the middle the course coordinator with a thumbs up for his two students who have a certificate.
November 4, 2025 at 9:52 AM
jissonews.bsky.social
10月2日(金)14:30-17:40に、 #IEEE #EPS Japan Chapterが『第70回イブニングミーティング 〜千歳市に芽吹く半導体パッケージング技術サプライチェーン〜』を開催。講演6件。先端パッケージ・光電融合技術から量子コンピューティング、CPO光接続、地域のまちづくりまで。北海道千歳市・公立千歳科学技術大学およびオンラインにて。詳細は https://x.gd/CZbLf に。
#EveningMeeting #SemiconductorPackaging #CPO #QuantumComputing
September 3, 2026 at 11:45 PM
jissonews.bsky.social
3月6日(金)16:00-18:30に、 #IEEE #EPS Japan Chapterが『第68回イブニングミーティング ～ 高速通信と低消費電力を可能にする半導体パッケージ構造とそれを支えるポリマー等の材料 ～』を開催。講演4件。川崎市川崎区・味の素㈱およびオンラインにて。詳細は buff.ly/gm4W7nc に。
#EveningMeeting #Material #SemiconductorPackaging
February 9, 2026 at 4:18 AM
edsonbellido.bsky.social
2.5D packaging is critical for AI bandwidth, but what are its hidden reliability costs? Thermomechanical stress from material CTE mismatches is a top concern. 📉 #SemiconductorPackaging #AdvancedPackaging
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August 22, 2026 at 10:02 PM
m-rfr.bsky.social
(13) Multi-Chip Module Market: Powering the Next Generation of Advanced Electronics | LinkedIn www.linkedin.com/pulse/multi-... #MultiChipModule #MCM #AdvancedPackaging #SemiconductorPackaging #ChipTechnology #Electronics #SemiconductorIndustry #MarketResearch
Multi-Chip Module Market: Powering the Next Generation of Advanced Electronics
The semiconductor industry is moving toward greater integration, smaller form factors, and higher performance. As electronic devices become increasingly sophisticated, manufacturers need packaging tec...
www.linkedin.com
August 11, 2026 at 10:11 AM
m-rfr.bsky.social
(13) 📦 Electronic Packaging Market: Driving the Next Generation of Semiconductors & Smart Electronics | LinkedIn www.linkedin.com/pulse/electr... #ElectronicPackaging #ElectronicsPackaging #SemiconductorPackaging #ElectronicComponents #AdvancedPackaging #ElectronicsIndustry
📦 Electronic Packaging Market: Driving the Next Generation of Semiconductors & Smart Electronics
As technologies like Artificial Intelligence (AI), 5G, electric vehicles (EVs), cloud computing, and IoT continue to advance, the demand for high-performance semiconductor packaging is growing rapidly...
www.linkedin.com
August 11, 2026 at 10:12 AM
semi1-98.bsky.social
Semiconductor Packaging Material Market Size, Share, Growth | Report 2035 www.marketresearchfuture.com/reports/semi...
#SemiconductorPackagingMaterialMarket #SemiconductorPackaging #ChipPackaging #Semiconductors #AdvancedPackaging #ElectronicsManufacturing #Microelectronics #PackagingMaterials
Semiconductor Packaging Material Market Size, Share & Growth Report 2035 | MRFR
The Semiconductor Packaging Material market is projected to grow from USD Billion 17.82 in 2024 to USD Billion 38.41 by 2035, at a CAGR of 7.23% during 2025-2035.
www.marketresearchfuture.com
August 4, 2026 at 10:03 AM
smidnya.bsky.social
Lead frames look simple — until you try to ship zero-defect semiconductor packages at scale.
know more: zurl.co/6qGZF
Contact us: 8956167814/8983000125
#Semiconductor #SemiconductorPackaging #LeadFrame #MachineVision #VisionInspection #SmidnyaTechnologies
January 23, 2026 at 9:47 AM
smidnya.bsky.social
In semiconductor packaging, the smallest defect can become the biggest reliability failure.
Website: zurl.co/A9nIW
Contact us:8956167814/8983000125
#Semiconductor#SemiconductorPackaging#MachineVision#VisionInspection#ProcessControl #SmidnyaTechnologies
January 21, 2026 at 9:55 AM
ganesh8000.bsky.social
FOPLP Market www.linkedin.com/feed/update/...
#foplpmarket #fanoutpanellevelpackaging #advancedpackaging #semiconductorpackaging #aichippackaging #panellevelpackaging #osatmarket #heterogeneousintegration | Future Foresights
𝐆𝐥𝐨𝐛𝐚𝐥 𝐅𝐎𝐏𝐋𝐏 𝐌𝐚𝐫𝐤𝐞𝐭 𝐒𝐢𝐳𝐞, 𝐆𝐞𝐨𝐩𝐨𝐥𝐢𝐭𝐢𝐜𝐚𝐥 𝐈𝐦𝐩𝐚𝐜𝐭, 𝐚𝐧𝐝 𝐓𝐨𝐩 𝐂𝐨𝐦𝐩𝐚𝐧𝐢𝐞𝐬 𝐀𝐧𝐚𝐥𝐲𝐬𝐢𝐬 (𝟐𝟎𝟐𝟔–𝟐𝟎𝟑𝟑) 𝐓𝐡𝐞 𝐠𝐥𝐨𝐛𝐚𝐥 𝐅𝐎𝐏𝐋𝐏 𝐦𝐚𝐫𝐤𝐞𝐭 𝐢𝐬 𝐩𝐫𝐨𝐣𝐞𝐜𝐭𝐞𝐝 𝐭𝐨 𝐠𝐫𝐨𝐰 𝐟𝐫𝐨𝐦 𝐔𝐒𝐃 𝟏.𝟖 𝐛𝐢𝐥𝐥𝐢𝐨𝐧 𝐢𝐧 𝟐𝟎𝟐𝟔 𝐭𝐨 𝐚𝐩𝐩𝐫𝐨𝐱𝐢𝐦𝐚𝐭𝐞𝐥𝐲 𝐔𝐒𝐃 𝟕.𝟒 𝐛𝐢𝐥𝐥𝐢𝐨𝐧 𝐛𝐲 𝟐𝟎𝟑...
www.linkedin.com
April 9, 2026 at 12:15 PM
shwetapande.bsky.social
FOPLP Market www.linkedin.com/feed/update/...
#foplpmarket #fanoutpanellevelpackaging #advancedpackaging #semiconductorpackaging #aichippackaging #panellevelpackaging #osatmarket #heterogeneousintegration | Future Foresights
𝐆𝐥𝐨𝐛𝐚𝐥 𝐅𝐎𝐏𝐋𝐏 𝐌𝐚𝐫𝐤𝐞𝐭 𝐒𝐢𝐳𝐞, 𝐆𝐞𝐨𝐩𝐨𝐥𝐢𝐭𝐢𝐜𝐚𝐥 𝐈𝐦𝐩𝐚𝐜𝐭, 𝐚𝐧𝐝 𝐓𝐨𝐩 𝐂𝐨𝐦𝐩𝐚𝐧𝐢𝐞𝐬 𝐀𝐧𝐚𝐥𝐲𝐬𝐢𝐬 (𝟐𝟎𝟐𝟔–𝟐𝟎𝟑𝟑) 𝐓𝐡𝐞 𝐠𝐥𝐨𝐛𝐚𝐥 𝐅𝐎𝐏𝐋𝐏 𝐦𝐚𝐫𝐤𝐞𝐭 𝐢𝐬 𝐩𝐫𝐨𝐣𝐞𝐜𝐭𝐞𝐝 𝐭𝐨 𝐠𝐫𝐨𝐰 𝐟𝐫𝐨𝐦 𝐔𝐒𝐃 𝟏.𝟖 𝐛𝐢𝐥𝐥𝐢𝐨𝐧 𝐢𝐧 𝟐𝟎𝟐𝟔 𝐭𝐨 𝐚𝐩𝐩𝐫𝐨𝐱𝐢𝐦𝐚𝐭𝐞𝐥𝐲 𝐔𝐒𝐃 𝟕.𝟒 𝐛𝐢𝐥𝐥𝐢𝐨𝐧 𝐛𝐲 𝟐𝟎𝟑...
www.linkedin.com
April 9, 2026 at 7:45 AM
sakshikale17.bsky.social
Advanced Semiconductor Packaging Market Dynamics: Growth Drivers & Investment Potential

#SemiconductorPackaging #AdvancedPackaging #SemiconductorIndustry #TechTrends #ChipManufacturing #MarketAnalysis #GrowthForecast #IndustryInsights #TechInnovation #ElectronicsMarket
March 24, 2025 at 7:32 AM
amtechmicro.bsky.social
www.youtube.com/watch?v=rzZA...
Discover AmTECH Microelectronics a OSAT headquartered in Silicon Valley.

#microelectronics #semiconductorpackaging #photonics #ic #flipchip #diebonding #wirebonding
AmTECH Video Microelectronics and Photonics Packaging
YouTube video by AmTECH Microelectronics
www.youtube.com
May 13, 2025 at 7:56 PM
prathameshb99.bsky.social
FOPLP Market www.linkedin.com/feed/update/...
#foplpmarket #fanoutpanellevelpackaging #advancedpackaging #semiconductorpackaging #aichippackaging #panellevelpackaging #osatmarket #heterogeneousintegration | Future Foresights
𝐆𝐥𝐨𝐛𝐚𝐥 𝐅𝐎𝐏𝐋𝐏 𝐌𝐚𝐫𝐤𝐞𝐭 𝐒𝐢𝐳𝐞, 𝐆𝐞𝐨𝐩𝐨𝐥𝐢𝐭𝐢𝐜𝐚𝐥 𝐈𝐦𝐩𝐚𝐜𝐭, 𝐚𝐧𝐝 𝐓𝐨𝐩 𝐂𝐨𝐦𝐩𝐚𝐧𝐢𝐞𝐬 𝐀𝐧𝐚𝐥𝐲𝐬𝐢𝐬 (𝟐𝟎𝟐𝟔–𝟐𝟎𝟑𝟑) 𝐓𝐡𝐞 𝐠𝐥𝐨𝐛𝐚𝐥 𝐅𝐎𝐏𝐋𝐏 𝐦𝐚𝐫𝐤𝐞𝐭 𝐢𝐬 𝐩𝐫𝐨𝐣𝐞𝐜𝐭𝐞𝐝 𝐭𝐨 𝐠𝐫𝐨𝐰 𝐟𝐫𝐨𝐦 𝐔𝐒𝐃 𝟏.𝟖 𝐛𝐢𝐥𝐥𝐢𝐨𝐧 𝐢𝐧 𝟐𝟎𝟐𝟔 𝐭𝐨 𝐚𝐩𝐩𝐫𝐨𝐱𝐢𝐦𝐚𝐭𝐞𝐥𝐲 𝐔𝐒𝐃 𝟕.𝟒 𝐛𝐢𝐥𝐥𝐢𝐨𝐧 𝐛𝐲 𝟐𝟎𝟑...
www.linkedin.com
April 9, 2026 at 1:48 PM
pravinpande.bsky.social
FOPLP Market www.linkedin.com/feed/update/...
#foplpmarket #fanoutpanellevelpackaging #advancedpackaging #semiconductorpackaging #aichippackaging #panellevelpackaging #osatmarket #heterogeneousintegration | Future Foresights
𝐆𝐥𝐨𝐛𝐚𝐥 𝐅𝐎𝐏𝐋𝐏 𝐌𝐚𝐫𝐤𝐞𝐭 𝐒𝐢𝐳𝐞, 𝐆𝐞𝐨𝐩𝐨𝐥𝐢𝐭𝐢𝐜𝐚𝐥 𝐈𝐦𝐩𝐚𝐜𝐭, 𝐚𝐧𝐝 𝐓𝐨𝐩 𝐂𝐨𝐦𝐩𝐚𝐧𝐢𝐞𝐬 𝐀𝐧𝐚𝐥𝐲𝐬𝐢𝐬 (𝟐𝟎𝟐𝟔–𝟐𝟎𝟑𝟑) 𝐓𝐡𝐞 𝐠𝐥𝐨𝐛𝐚𝐥 𝐅𝐎𝐏𝐋𝐏 𝐦𝐚𝐫𝐤𝐞𝐭 𝐢𝐬 𝐩𝐫𝐨𝐣𝐞𝐜𝐭𝐞𝐝 𝐭𝐨 𝐠𝐫𝐨𝐰 𝐟𝐫𝐨𝐦 𝐔𝐒𝐃 𝟏.𝟖 𝐛𝐢𝐥𝐥𝐢𝐨𝐧 𝐢𝐧 𝟐𝟎𝟐𝟔 𝐭𝐨 𝐚𝐩𝐩𝐫𝐨𝐱𝐢𝐦𝐚𝐭𝐞𝐥𝐲 𝐔𝐒𝐃 𝟕.𝟒 𝐛𝐢𝐥𝐥𝐢𝐨𝐧 𝐛𝐲 𝟐𝟎𝟑...
www.linkedin.com
April 9, 2026 at 3:20 PM
pravinpande.bsky.social
FOPLP Market www.linkedin.com/feed/update/...
#foplpmarket #fanoutpanellevelpackaging #advancedpackaging #semiconductorpackaging #aichippackaging #panellevelpackaging #osatmarket #heterogeneousintegration | Future Foresights
𝐆𝐥𝐨𝐛𝐚𝐥 𝐅𝐎𝐏𝐋𝐏 𝐌𝐚𝐫𝐤𝐞𝐭 𝐒𝐢𝐳𝐞, 𝐆𝐞𝐨𝐩𝐨𝐥𝐢𝐭𝐢𝐜𝐚𝐥 𝐈𝐦𝐩𝐚𝐜𝐭, 𝐚𝐧𝐝 𝐓𝐨𝐩 𝐂𝐨𝐦𝐩𝐚𝐧𝐢𝐞𝐬 𝐀𝐧𝐚𝐥𝐲𝐬𝐢𝐬 (𝟐𝟎𝟐𝟔–𝟐𝟎𝟑𝟑) 𝐓𝐡𝐞 𝐠𝐥𝐨𝐛𝐚𝐥 𝐅𝐎𝐏𝐋𝐏 𝐦𝐚𝐫𝐤𝐞𝐭 𝐢𝐬 𝐩𝐫𝐨𝐣𝐞𝐜𝐭𝐞𝐝 𝐭𝐨 𝐠𝐫𝐨𝐰 𝐟𝐫𝐨𝐦 𝐔𝐒𝐃 𝟏.𝟖 𝐛𝐢𝐥𝐥𝐢𝐨𝐧 𝐢𝐧 𝟐𝟎𝟐𝟔 𝐭𝐨 𝐚𝐩𝐩𝐫𝐨𝐱𝐢𝐦𝐚𝐭𝐞𝐥𝐲 𝐔𝐒𝐃 𝟕.𝟒 𝐛𝐢𝐥𝐥𝐢𝐨𝐧 𝐛𝐲 𝟐𝟎𝟑...
www.linkedin.com
April 9, 2026 at 7:00 AM
sumedhkhatale.bsky.social
FOPLP Market www.linkedin.com/feed/update/...
#foplpmarket #fanoutpanellevelpackaging #advancedpackaging #semiconductorpackaging #aichippackaging #panellevelpackaging #osatmarket #heterogeneousintegration | Future Foresights
𝐆𝐥𝐨𝐛𝐚𝐥 𝐅𝐎𝐏𝐋𝐏 𝐌𝐚𝐫𝐤𝐞𝐭 𝐒𝐢𝐳𝐞, 𝐆𝐞𝐨𝐩𝐨𝐥𝐢𝐭𝐢𝐜𝐚𝐥 𝐈𝐦𝐩𝐚𝐜𝐭, 𝐚𝐧𝐝 𝐓𝐨𝐩 𝐂𝐨𝐦𝐩𝐚𝐧𝐢𝐞𝐬 𝐀𝐧𝐚𝐥𝐲𝐬𝐢𝐬 (𝟐𝟎𝟐𝟔–𝟐𝟎𝟑𝟑) 𝐓𝐡𝐞 𝐠𝐥𝐨𝐛𝐚𝐥 𝐅𝐎𝐏𝐋𝐏 𝐦𝐚𝐫𝐤𝐞𝐭 𝐢𝐬 𝐩𝐫𝐨𝐣𝐞𝐜𝐭𝐞𝐝 𝐭𝐨 𝐠𝐫𝐨𝐰 𝐟𝐫𝐨𝐦 𝐔𝐒𝐃 𝟏.𝟖 𝐛𝐢𝐥𝐥𝐢𝐨𝐧 𝐢𝐧 𝟐𝟎𝟐𝟔 𝐭𝐨 𝐚𝐩𝐩𝐫𝐨𝐱𝐢𝐦𝐚𝐭𝐞𝐥𝐲 𝐔𝐒𝐃 𝟕.𝟒 𝐛𝐢𝐥𝐥𝐢𝐨𝐧 𝐛𝐲 𝟐𝟎𝟑...
www.linkedin.com
April 10, 2026 at 8:28 AM
citcnetherlands.bsky.social
🧪Happy faces after the final day of classes at this year's Semiconductor Packaging University Program. The students have completed the theoretical part. Congratulations to all - put your newly acquired knowledge to good use!
#accesstoeducation #semiconductorpackaging
Happy students with a certificate in their hands. They just finished the theoretical part of the CITC Semiconductor Packaging University Program.
October 15, 2025 at 8:39 AM
citcnetherlands.bsky.social
🧪 Today is Alex Harper's last day at CITC. Last week, he successfully presented and defended his work at the HAN University of Applied Sciences. His work on the new design of a slit nozzle was graded with a 7. Congratulations Alex on this achievement!
#accesstoeducation #semiconductorpackaging
Young male student standing in front of a video screen while presenting his final project. The project concerned a new design for a slit nozzle which is used in semiconductor packaging.
June 27, 2025 at 10:08 AM
citcnetherlands.bsky.social
🧪 Welcome to our new intern: Alex Harper. He will be working on improvements to a new dispensing slit nozzle design (patent pending) which differs from other nozzles in that the design is flexible. He will also define process parameters - good luck! #accesstoeducation #semiconductorpackaging
Young student Alex Harper is standing in front of a dispensing machine in a scientific lab. He will work as an intern on the design of a new slit nozzle for this machine.
February 14, 2025 at 8:58 AM
🔧📦 Unlocking the future of tech with advanced #SemiconductorPackaging! 🌐 Discover the trends driving innovation and efficiency in the global market. Stay ahead with our latest insights! 📊💡Visit: shorturl.at/58CWo #TechTrends #Innovation #Semiconductors #MarketResearch
July 10, 2024 at 4:24 AM