PC Watch: 【福田昭のセミコン業界最前線】メモリコスト6分の1でAI推論、Samsungの「zNAND-O」
【福田昭のセミコン業界最前線】メモリコスト6分の1でAI推論、Samsungの「zNAND-O」
PC Watch
pc.watch.impress.co.jp
September 27, 2026 at 9:35 PM
PC Watch: 【福田昭のセミコン業界最前線】メモリコスト6分の1でAI推論、Samsungの「zNAND-O」
Samsung previews zHBM, which vertically stacks HBM atop AI accelerators, and zNAND-O, built on V-NAND, and unveils the industry's first V10 BV-NAND architecture (Yoolim Lee/Bloomberg)
Main Link | Techmeme Permalink
Main Link | Techmeme Permalink
August 4, 2026 at 8:26 PM
Samsung previews zHBM, which vertically stacks HBM atop AI accelerators, and zNAND-O, built on V-NAND, and unveils the industry's first V10 BV-NAND architecture (Yoolim Lee/Bloomberg)
Main Link | Techmeme Permalink
Main Link | Techmeme Permalink
zNAND-O: “the first step toward high bandwidth flash” … “From 2028, zNAND-O will drive your AI innovation.
August 4, 2026 at 8:05 PM
zNAND-O: “the first step toward high bandwidth flash” … “From 2028, zNAND-O will drive your AI innovation.
Samsung debuts three next-generation memory technologies for AI data centers — zHBM, zNAND-O, and BV-NAND all rely on advanced wafer bonding technologies
Samsung debuts three next-generation memory technologies for AI data centers — zHBM, zNAND-O, and BV-NAND all rely on advanced wafer bonding technologies
Next generation wafer bonding enables innovative types of memory
www.tomshardware.com
August 8, 2026 at 1:30 PM
Samsung debuts three next-generation memory technologies for AI data centers — zHBM, zNAND-O, and BV-NAND all rely on advanced wafer bonding technologies
Here at #FMS2026 Samsung, going beyond 2.5D HBM4e/5, discloses future 3D zHBM and zNAND-O.
zHBM: You knew it was inevitable. IMO this 3D integration will require a tour de force of packaging and codesign to match the pitches of the SoCs x stacks and cope with all the power and thermal challenges.
zHBM: You knew it was inevitable. IMO this 3D integration will require a tour de force of packaging and codesign to match the pitches of the SoCs x stacks and cope with all the power and thermal challenges.
August 4, 2026 at 7:50 PM
Here at #FMS2026 Samsung, going beyond 2.5D HBM4e/5, discloses future 3D zHBM and zNAND-O.
zHBM: You knew it was inevitable. IMO this 3D integration will require a tour de force of packaging and codesign to match the pitches of the SoCs x stacks and cope with all the power and thermal challenges.
zHBM: You knew it was inevitable. IMO this 3D integration will require a tour de force of packaging and codesign to match the pitches of the SoCs x stacks and cope with all the power and thermal challenges.
#中央社即時新聞 財經新聞 15:05
突破AI資料中心瓶頸 三星打造3D記憶體與儲存解決方案
（中央社記者張建中台北1日電）三星電子記憶體產品規劃部門副總裁崔璋石（Jangseok Choi）今天提出CUBE策略，以全面的半導體能力推動3D架構發展，打造下一代3D記憶體與儲存解決方案，包含zHBM及zNAND-O，解決AI資料中心及裝置端AI不同環境下的瓶頸，大幅提升效能。
https://www.cna.com.tw/news/afe/202609010167.aspx
#新聞
突破AI資料中心瓶頸 三星打造3D記憶體與儲存解決方案
（中央社記者張建中台北1日電）三星電子記憶體產品規劃部門副總裁崔璋石（Jangseok Choi）今天提出CUBE策略，以全面的半導體能力推動3D架構發展，打造下一代3D記憶體與儲存解決方案，包含zHBM及zNAND-O，解決AI資料中心及裝置端AI不同環境下的瓶頸，大幅提升效能。
https://www.cna.com.tw/news/afe/202609010167.aspx
#新聞
突破AI資料中心瓶頸 三星打造3D記憶體與儲存解決方案 | 產經 | 中央社 CNA
三星電子記憶體產品規劃部門副總裁崔璋石（Jangseok Choi）今天提出CUBE策略，以全面的半導體能力推動3D架構發展，打造下一代3D記憶體與儲存解決方案，包含zHBM及zNAND-O，解決AI資料中心及裝置端AI不同環境下的瓶頸，大幅提升效能。
www.cna.com.tw
September 1, 2026 at 8:25 AM
#中央社即時新聞 財經新聞 15:05
突破AI資料中心瓶頸 三星打造3D記憶體與儲存解決方案
（中央社記者張建中台北1日電）三星電子記憶體產品規劃部門副總裁崔璋石（Jangseok Choi）今天提出CUBE策略，以全面的半導體能力推動3D架構發展，打造下一代3D記憶體與儲存解決方案，包含zHBM及zNAND-O，解決AI資料中心及裝置端AI不同環境下的瓶頸，大幅提升效能。
https://www.cna.com.tw/news/afe/202609010167.aspx
#新聞
突破AI資料中心瓶頸 三星打造3D記憶體與儲存解決方案
（中央社記者張建中台北1日電）三星電子記憶體產品規劃部門副總裁崔璋石（Jangseok Choi）今天提出CUBE策略，以全面的半導體能力推動3D架構發展，打造下一代3D記憶體與儲存解決方案，包含zHBM及zNAND-O，解決AI資料中心及裝置端AI不同環境下的瓶頸，大幅提升效能。
https://www.cna.com.tw/news/afe/202609010167.aspx
#新聞
🇰🇷 삼성 "HBM5는 HBM4E의 2배, zHBM은 8배"…로드맵 공개
세미콘 타이완에서 목표치가 제시됐습니다. HBM5는 HBM4E 대비 성능 2배, 와트당 성능 20% 개선, 열 저항 20% 감소를 겨냥합니다.
다음 세대는 폭이 다릅니다. zHBM은 성능 8배, 와트당 성능 3배, 열 저항 75~90% 감소를 목표로 잡았습니다. 적층이 아니라 3D 구조에 거는 판단입니다.
낸드 쪽도 있습니다. zNAND-O는 2028년 샘플링 계획입니다.
다만 로드맵 목표이지 출하 사양은 아닙니다.
세미콘 타이완에서 목표치가 제시됐습니다. HBM5는 HBM4E 대비 성능 2배, 와트당 성능 20% 개선, 열 저항 20% 감소를 겨냥합니다.
다음 세대는 폭이 다릅니다. zHBM은 성능 8배, 와트당 성능 3배, 열 저항 75~90% 감소를 목표로 잡았습니다. 적층이 아니라 3D 구조에 거는 판단입니다.
낸드 쪽도 있습니다. zNAND-O는 2028년 샘플링 계획입니다.
다만 로드맵 목표이지 출하 사양은 아닙니다.
September 1, 2026 at 7:22 AM
🇰🇷 삼성 "HBM5는 HBM4E의 2배, zHBM은 8배"…로드맵 공개
세미콘 타이완에서 목표치가 제시됐습니다. HBM5는 HBM4E 대비 성능 2배, 와트당 성능 20% 개선, 열 저항 20% 감소를 겨냥합니다.
다음 세대는 폭이 다릅니다. zHBM은 성능 8배, 와트당 성능 3배, 열 저항 75~90% 감소를 목표로 잡았습니다. 적층이 아니라 3D 구조에 거는 판단입니다.
낸드 쪽도 있습니다. zNAND-O는 2028년 샘플링 계획입니다.
다만 로드맵 목표이지 출하 사양은 아닙니다.
세미콘 타이완에서 목표치가 제시됐습니다. HBM5는 HBM4E 대비 성능 2배, 와트당 성능 20% 개선, 열 저항 20% 감소를 겨냥합니다.
다음 세대는 폭이 다릅니다. zHBM은 성능 8배, 와트당 성능 3배, 열 저항 75~90% 감소를 목표로 잡았습니다. 적층이 아니라 3D 구조에 거는 판단입니다.
낸드 쪽도 있습니다. zNAND-O는 2028년 샘플링 계획입니다.
다만 로드맵 목표이지 출하 사양은 아닙니다.
📢 三星電子記憶體產品規劃部門副總裁崔璋石（Jangseok Choi）今天提出CUBE策略，以全面的半導體能力推動3D架構發展，打造下一代3D記憶體與儲存解決方案，包含zHBM及zNAND-O，解決AI資料中心及裝置端AI不同環境下的瓶頸，大幅提升效能。
👉AI机器人：RNZ新闻摘要
👉AI机器人：RNZ新闻摘要
突破AI資料中心瓶頸 三星打造3D記憶體與儲存解決方案 | 產經 | 中央社 CNA
www.cna.com.tw
September 1, 2026 at 9:04 AM
📢 三星電子記憶體產品規劃部門副總裁崔璋石（Jangseok Choi）今天提出CUBE策略，以全面的半導體能力推動3D架構發展，打造下一代3D記憶體與儲存解決方案，包含zHBM及zNAND-O，解決AI資料中心及裝置端AI不同環境下的瓶頸，大幅提升效能。
👉AI机器人：RNZ新闻摘要
👉AI机器人：RNZ新闻摘要
Αναλυτική παρουσίαση των νέων τεχνολογιών 3D μνήμης zHBM, zNAND-O και V10 BV-NAND (400+ layers) που ανακοίνωσε επίσημα η Samsung στο συνέδριο FMS 2026 για την ενίσχυση των υποδομών AI.
www.techgear.gr/i-samsung-pa...
www.techgear.gr/i-samsung-pa...
Η Samsung παρουσιάζει τις τεχνολογίες zHBM και zNAND-O για υποδομές Τεχνητής Νοημοσύνης
Αναλυτική παρουσίαση των νέων τεχνολογιών 3D μνήμης zHBM, zNAND-O και V10 BV-NAND (400+ layers) που ανακοίνωσε επίσημα η Samsung στο συνέδριο FMS 2026 για την ενίσχυση των υποδομών AI.
www.techgear.gr
August 14, 2026 at 7:22 PM
Αναλυτική παρουσίαση των νέων τεχνολογιών 3D μνήμης zHBM, zNAND-O και V10 BV-NAND (400+ layers) που ανακοίνωσε επίσημα η Samsung στο συνέδριο FMS 2026 για την ενίσχυση των υποδομών AI.
www.techgear.gr/i-samsung-pa...
www.techgear.gr/i-samsung-pa...
Samsung's FMS reveal: three memory techs, one common thread — wafer bonding.
zHBM: HBM stacked on top of the accelerator, claims 8x "performance of HBM5"
zNAND-O: NAND bonded onto logic
BV-NAND: 400-layer, 28 Gb/mm2, 5600 MT/s
Memory is migrating onto compute.
zHBM: HBM stacked on top of the accelerator, claims 8x "performance of HBM5"
zNAND-O: NAND bonded onto logic
BV-NAND: 400-layer, 28 Gb/mm2, 5600 MT/s
Memory is migrating onto compute.
August 10, 2026 at 3:32 PM
Samsung's FMS reveal: three memory techs, one common thread — wafer bonding.
zHBM: HBM stacked on top of the accelerator, claims 8x "performance of HBM5"
zNAND-O: NAND bonded onto logic
BV-NAND: 400-layer, 28 Gb/mm2, 5600 MT/s
Memory is migrating onto compute.
zHBM: HBM stacked on top of the accelerator, claims 8x "performance of HBM5"
zNAND-O: NAND bonded onto logic
BV-NAND: 400-layer, 28 Gb/mm2, 5600 MT/s
Memory is migrating onto compute.
Samsung just showed memory architectures that don't exist yet, but they reveal exactly how AI chips will work in three years.
#AICompute #Memory #Samsung #gaming
#AICompute #Memory #Samsung #gaming
Samsung's Memory Stack Goes Vertical: What zHBM, zNAND-O, and V10 BV-NAND Actually Mean
Samsung unveiled three wafer-bonded memory architectures at FMS 2026—zHBM, zNAND-O, and V10 BV-NAND. Here's what the specs say, what's real today, and what's still a concept.
signal-noise.net
August 8, 2026 at 4:50 PM
Samsung just showed memory architectures that don't exist yet, but they reveal exactly how AI chips will work in three years.
#AICompute #Memory #Samsung #gaming
#AICompute #Memory #Samsung #gaming
Samsung debuts three new memory technologies – zHBM, zNAND-O, and BV-NAND
comments · posted on 2026.08.08 at 00:22:58 (c=0, p=3)
comments · posted on 2026.08.08 at 00:22:58 (c=0, p=3)
August 8, 2026 at 5:16 AM
Samsung debuts three new memory technologies – zHBM, zNAND-O, and BV-NAND
comments · posted on 2026.08.08 at 00:22:58 (c=0, p=3)
comments · posted on 2026.08.08 at 00:22:58 (c=0, p=3)
Samsung presenta sus nuevas memorias zHBM y zNAND-O para mejorar el rendimiento de la IA - https://pisapapeles.net/samsung-presenta-sus-nuevas-memorias-zhbm-y-znand-o-para-mejorar-el-rendimiento-de-la-ia/
Samsung presenta sus nuevas memorias zHBM y zNAND-O para mejorar el rendimiento de la IA
Descubre cómo las innovadoras memorias zHBM Samsung y la tecnología zNAND-O revolucionarán el rendimiento de la inteligencia artificial.
pisapapeles.net
August 6, 2026 at 9:05 PM
Samsung presenta sus nuevas memorias zHBM y zNAND-O para mejorar el rendimiento de la IA - https://pisapapeles.net/samsung-presenta-sus-nuevas-memorias-zhbm-y-znand-o-para-mejorar-el-rendimiento-de-la-ia/
Samsung Unveils zHBM, zNAND-O and BV-NAND at FMS 2026, Betting on Wafer Bonding for AI Memory
At the Future of Memory and Storage 2026 conference, Samsung introduced thre…
https://revealednews.com/hardware/samsung-unveils-zhbm-znand-o-and-bv-nand-at-fms-2026-betting-on-wafer-bonding-for-ai-memory
At the Future of Memory and Storage 2026 conference, Samsung introduced thre…
https://revealednews.com/hardware/samsung-unveils-zhbm-znand-o-and-bv-nand-at-fms-2026-betting-on-wafer-bonding-for-ai-memory
August 6, 2026 at 7:06 PM
Samsung Unveils zHBM, zNAND-O and BV-NAND at FMS 2026, Betting on Wafer Bonding for AI Memory
At the Future of Memory and Storage 2026 conference, Samsung introduced thre…
https://revealednews.com/hardware/samsung-unveils-zhbm-znand-o-and-bv-nand-at-fms-2026-betting-on-wafer-bonding-for-ai-memory
At the Future of Memory and Storage 2026 conference, Samsung introduced thre…
https://revealednews.com/hardware/samsung-unveils-zhbm-znand-o-and-bv-nand-at-fms-2026-betting-on-wafer-bonding-for-ai-memory
[AI 시대 차세대 메모리 혁명] HBM을 보완하는 새로운 메모리 계층(NAND Tier)의 등장 : 삼성전자 'zNAND-O' VS SK하이닉스 & 샌디스크 'HBF'
m.blog.naver.com/newsky144th/...
m.blog.naver.com/newsky144th/...
August 6, 2026 at 3:35 PM
[AI 시대 차세대 메모리 혁명] HBM을 보완하는 새로운 메모리 계층(NAND Tier)의 등장 : 삼성전자 'zNAND-O' VS SK하이닉스 & 샌디스크 'HBF'
m.blog.naver.com/newsky144th/...
m.blog.naver.com/newsky144th/...
Samsung presenta su visión de memoria 3D para infraestructura de IA - https://www.tabulado.net/samsung-presenta-su-vision-de-memoria-3d-para-infraestructura-de-ia/
Samsung presenta su visión de memoria 3D para infraestructura de IA
La propuesta combina zHBM, zNAND-O y V10 BV-NAND para elevar ancho de banda, densidad y eficiencia en servidores y sistemas de inteligencia artificial
www.tabulado.net
August 6, 2026 at 10:05 PM
Samsung presenta su visión de memoria 3D para infraestructura de IA - https://www.tabulado.net/samsung-presenta-su-vision-de-memoria-3d-para-infraestructura-de-ia/
🚨 NEWS: Samsung presenta zNAND-O e LPDDR5X-PIM per accelerare l'AI nei data center
Leggi L'articolo completo e seguici per rimanere sempre aggiornato! 🧡
🚀 LINK: https://meteoraweb.com/news/samsung-presenta-znand-o-e-lpddr5x-pim-per-accelerare-lai-nei-data-center?utm_source=bluesky&utm_me
Leggi L'articolo completo e seguici per rimanere sempre aggiornato! 🧡
🚀 LINK: https://meteoraweb.com/news/samsung-presenta-znand-o-e-lpddr5x-pim-per-accelerare-lai-nei-data-center?utm_source=bluesky&utm_me
Samsung presenta zNAND-O e LPDDR5X-PIM per accelerare l'AI nei data center
🚨 NEWS: Samsung presenta zNAND-O e LPDDR5X-PIM per accelerare l'AI nei data center
Leggi L'articolo completo e seguici per rimanere sempre aggiornato
meteoraweb.com
August 5, 2026 at 8:40 PM
🚨 NEWS: Samsung presenta zNAND-O e LPDDR5X-PIM per accelerare l'AI nei data center
Leggi L'articolo completo e seguici per rimanere sempre aggiornato! 🧡
🚀 LINK: https://meteoraweb.com/news/samsung-presenta-znand-o-e-lpddr5x-pim-per-accelerare-lai-nei-data-center?utm_source=bluesky&utm_me
Leggi L'articolo completo e seguici per rimanere sempre aggiornato! 🧡
🚀 LINK: https://meteoraweb.com/news/samsung-presenta-znand-o-e-lpddr5x-pim-per-accelerare-lai-nei-data-center?utm_source=bluesky&utm_me