#Semiconductors #OpenROAD #OpenLane #OpenSourceEDA #ChipDesign #VLSI #PhysicalDesign #AIForHardware #3DIC
@naveen_venk
@naveen_venk
September 24, 2026 at 4:08 AM
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3.5D Heterogeneous Scale-In, H. Bharadwaj, Broadcom, Chiplets & Adv Packaging, OCP APAC Summit, 26-08-11 www.youtube.com/watch?v=gy5j...
drive.google.com/file/d/1tzrO...
IanCutress, 08-31 x.com/IanCutress/s...
MONAKA, HC '26 chipsandcheese.com/p/hot-chips-...
3DIC, TSMC bsky.app/profile/ogaw...
3.5D Heterogeneous Scale-In, H. Bharadwaj, Broadcom, Chiplets & Adv Packaging, OCP APAC Summit, 26-08-11 www.youtube.com/watch?v=gy5j...
drive.google.com/file/d/1tzrO...
IanCutress, 08-31 x.com/IanCutress/s...
MONAKA, HC '26 chipsandcheese.com/p/hot-chips-...
3DIC, TSMC bsky.app/profile/ogaw...
September 18, 2026 at 1:33 AM
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3.5D Heterogeneous Scale-In, H. Bharadwaj, Broadcom, Chiplets & Adv Packaging, OCP APAC Summit, 26-08-11 www.youtube.com/watch?v=gy5j...
drive.google.com/file/d/1tzrO...
IanCutress, 08-31 x.com/IanCutress/s...
MONAKA, HC '26 chipsandcheese.com/p/hot-chips-...
3DIC, TSMC bsky.app/profile/ogaw...
3.5D Heterogeneous Scale-In, H. Bharadwaj, Broadcom, Chiplets & Adv Packaging, OCP APAC Summit, 26-08-11 www.youtube.com/watch?v=gy5j...
drive.google.com/file/d/1tzrO...
IanCutress, 08-31 x.com/IanCutress/s...
MONAKA, HC '26 chipsandcheese.com/p/hot-chips-...
3DIC, TSMC bsky.app/profile/ogaw...
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"Advancing 3DIC Technologies to Propel AI Innovations", Dr. Jun He, VP of Advanced Packaging, Technology & Service, TSMC, Keynote, OCP APAC Summit, 26-08-11 www.youtube.com/watch?v=-Rfv...
drive.google.com/file/d/16HNR...
3DIC Technology & Manufacturing Challenges
AMAT bsky.app/profile/ogaw...
"Advancing 3DIC Technologies to Propel AI Innovations", Dr. Jun He, VP of Advanced Packaging, Technology & Service, TSMC, Keynote, OCP APAC Summit, 26-08-11 www.youtube.com/watch?v=-Rfv...
drive.google.com/file/d/16HNR...
3DIC Technology & Manufacturing Challenges
AMAT bsky.app/profile/ogaw...
September 16, 2026 at 8:21 AM
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"Advancing 3DIC Technologies to Propel AI Innovations", Dr. Jun He, VP of Advanced Packaging, Technology & Service, TSMC, Keynote, OCP APAC Summit, 26-08-11 www.youtube.com/watch?v=-Rfv...
drive.google.com/file/d/16HNR...
3DIC Technology & Manufacturing Challenges
AMAT bsky.app/profile/ogaw...
"Advancing 3DIC Technologies to Propel AI Innovations", Dr. Jun He, VP of Advanced Packaging, Technology & Service, TSMC, Keynote, OCP APAC Summit, 26-08-11 www.youtube.com/watch?v=-Rfv...
drive.google.com/file/d/16HNR...
3DIC Technology & Manufacturing Challenges
AMAT bsky.app/profile/ogaw...
📰 #Finance
"PeakView®‘s automated xLEM™ flow extends Lorentz’s 3D EM leadership from design to full-chip EM sign-off, delivering complete, LVS-clean electromagnetic verification for today’s and next-generation ultra-high-speed AI, photonics and IC/3DIC designs SANTA CLARA,…"
"PeakView®‘s automated xLEM™ flow extends Lorentz’s 3D EM leadership from design to full-chip EM sign-off, delivering complete, LVS-clean electromagnetic verification for today’s and next-generation ultra-high-speed AI, photonics and IC/3DIC designs SANTA CLARA,…"
Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP
financialpost.com
September 14, 2026 at 4:25 PM
ASE EVP identified two manufacturing bottlenecks amidst surging demand for AI packaging.
Source: DigiTimes Asia
Source: DigiTimes Asia
AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks
On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on September 1.
www.digitimes.com
September 4, 2026 at 12:24 AM
ASE EVP identified two manufacturing bottlenecks amidst surging demand for AI packaging.
Source: DigiTimes Asia
Source: DigiTimes Asia
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"Advancing 3DIC Technologies to Propel AI Innovations", Dr. Jun He, VP of Advanced Packaging, Technology and Service, TSMC, Keynote, OCP APAC Summit, Aug 11, 2026 drive.google.com/file/d/16HNR...
3DIC Technology & Manufacturing Challenges
Co-optimization for System & Chiplet Integration
"Advancing 3DIC Technologies to Propel AI Innovations", Dr. Jun He, VP of Advanced Packaging, Technology and Service, TSMC, Keynote, OCP APAC Summit, Aug 11, 2026 drive.google.com/file/d/16HNR...
3DIC Technology & Manufacturing Challenges
Co-optimization for System & Chiplet Integration
September 3, 2026 at 3:59 AM
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"Advancing 3DIC Technologies to Propel AI Innovations", Dr. Jun He, VP of Advanced Packaging, Technology and Service, TSMC, Keynote, OCP APAC Summit, Aug 11, 2026 drive.google.com/file/d/16HNR...
3DIC Technology & Manufacturing Challenges
Co-optimization for System & Chiplet Integration
"Advancing 3DIC Technologies to Propel AI Innovations", Dr. Jun He, VP of Advanced Packaging, Technology and Service, TSMC, Keynote, OCP APAC Summit, Aug 11, 2026 drive.google.com/file/d/16HNR...
3DIC Technology & Manufacturing Challenges
Co-optimization for System & Chiplet Integration
AMD built the Instinct MI455X on Synopsys 3DIC Compiler. Multi-die packaging is now where the hard problems live. Here's what it means for the stock:
https://youtu.be/AcD3gulOlI8
$SNPS 🎙️ @DrillDownPod #Dri#DrillDownEarningsn#Synopsys
https://youtu.be/AcD3gulOlI8
$SNPS 🎙️ @DrillDownPod #Dri#DrillDownEarningsn#Synopsys
August 28, 2026 at 7:15 PM
AMD built the Instinct MI455X on Synopsys 3DIC Compiler. Multi-die packaging is now where the hard problems live. Here's what it means for the stock:
https://youtu.be/AcD3gulOlI8
$SNPS 🎙️ @DrillDownPod #Dri#DrillDownEarningsn#Synopsys
https://youtu.be/AcD3gulOlI8
$SNPS 🎙️ @DrillDownPod #Dri#DrillDownEarningsn#Synopsys
Feed: "EE Times"
By: Yashasvini Razdan on Tuesday, June 23, 2026
By: Yashasvini Razdan on Tuesday, June 23, 2026
SNUG India 2026: Synopsys Unveils First Multiphysics Fusion Tools Since Ansys Deal
At SNUG India, Synopsys debuts its first Multiphysics Fusion tools post-Ansys, unifying EDA and physics for advanced node and 3DIC design.
www.eetimes.com
June 25, 2026 at 1:07 PM
Feed: "EE Times"
By: Yashasvini Razdan on Tuesday, June 23, 2026
By: Yashasvini Razdan on Tuesday, June 23, 2026
SNUG India 2026: Synopsys Unveils First Multiphysics Fusion Tools Since Ansys Deal
Synopsys debuts Multiphysics Fusion tools post-Ansys, unifying EDA and physics for advanced node and 3DIC designs.
Synopsys debuts Multiphysics Fusion tools post-Ansys, unifying EDA and physics for advanced node and 3DIC designs.
SNUG India 2026: Synopsys Unveils First Multiphysics Fusion Tools Since Ansys Deal
Synopsys debuts Multiphysics Fusion tools post-Ansys, unifying EDA and physics for advanced node and 3DIC designs.
www.eetimes.com
June 23, 2026 at 5:00 PM
SNUG India 2026: Synopsys Unveils First Multiphysics Fusion Tools Since Ansys Deal
Synopsys debuts Multiphysics Fusion tools post-Ansys, unifying EDA and physics for advanced node and 3DIC designs.
Synopsys debuts Multiphysics Fusion tools post-Ansys, unifying EDA and physics for advanced node and 3DIC designs.
[3/3] platform, which fully supports 2.5D/3D heterogeneous integrated packaging design and can realize full-link physical verification from 3DIC diversified collaborative design to packaging. The company's related products have been successfully commercialized.
June 22, 2026 at 9:04 AM
[3/3] platform, which fully supports 2.5D/3D heterogeneous integrated packaging design and can realize full-link physical verification from 3DIC diversified collaborative design to packaging. The company's related products have been successfully commercialized.
[2/3] design of heterogeneous integrated 3D chips to verification, filling the gap in domestic high-end 3DIC design tools, and is the only domestic full-process EDA provider for 3DIC design verification. The company launched the first industry-leading Argus 3DIC physical verification
June 22, 2026 at 9:04 AM
[2/3] design of heterogeneous integrated 3D chips to verification, filling the gap in domestic high-end 3DIC design tools, and is the only domestic full-process EDA provider for 3DIC design verification. The company launched the first industry-leading Argus 3DIC physical verification
[3/3] platform, which fully supports 2.5D/3D heterogeneous integrated packaging design and can realize full-link physical verification from 3DIC diversified collaborative design to packaging. The company's related products have been successfully commercialized.
June 22, 2026 at 8:56 AM
[3/3] platform, which fully supports 2.5D/3D heterogeneous integrated packaging design and can realize full-link physical verification from 3DIC diversified collaborative design to packaging. The company's related products have been successfully commercialized.
[2/3] design of heterogeneous integrated 3D chips to verification, filling the gap in domestic high-end 3DIC design tools, and is the only domestic full-process EDA provider for 3DIC design verification. The company launched the first industry-leading Argus 3DIC physical verification
June 22, 2026 at 8:56 AM
[2/3] design of heterogeneous integrated 3D chips to verification, filling the gap in domestic high-end 3DIC design tools, and is the only domestic full-process EDA provider for 3DIC design verification. The company launched the first industry-leading Argus 3DIC physical verification
I've been watching $SNPS. Synopsys reorients EDA to cloud-native AI flows; ARC divestiture makes software-first silicon enablement core. https://www.eetasia.com/synopsys-and-samsung-foundry-expand-ai-driven-design-test-and-3dic-enablement-for-advanced-nodes/
June 19, 2026 at 5:03 PM
I've been watching $SNPS. Synopsys reorients EDA to cloud-native AI flows; ARC divestiture makes software-first silicon enablement core. https://www.eetasia.com/synopsys-and-samsung-foundry-expand-ai-driven-design-test-and-3dic-enablement-for-advanced-nodes/
[4/4] industry-leading Argus 3DIC physical verification platform, which fully supports 2.5D/3D heterogeneous integrated packaging design and can realize full-link physical verification from 3DIC diversified collaborative design to packaging.
May 25, 2026 at 4:13 AM
[4/4] industry-leading Argus 3DIC physical verification platform, which fully supports 2.5D/3D heterogeneous integrated packaging design and can realize full-link physical verification from 3DIC diversified collaborative design to packaging.
[3/4] solution covering the collaborative design of heterogeneous integrated 3D chips to verification, filling the gap in domestic high-end 3DIC design tools. We are the only domestic full-process EDA provider for 3DIC design verification. The company has newly launched the first
May 25, 2026 at 4:12 AM
[3/4] solution covering the collaborative design of heterogeneous integrated 3D chips to verification, filling the gap in domestic high-end 3DIC design tools. We are the only domestic full-process EDA provider for 3DIC design verification. The company has newly launched the first
[2/4] AI, GPU, storage and other chips that are relying on 3DIC technology to break through the advanced processes and technologies of the post-Moore era. In spite of the computing power bottleneck, we have made advance plans in the field of 3DIC design EDA and built a full-process
May 25, 2026 at 4:12 AM
[2/4] AI, GPU, storage and other chips that are relying on 3DIC technology to break through the advanced processes and technologies of the post-Moore era. In spite of the computing power bottleneck, we have made advance plans in the field of 3DIC design EDA and built a full-process
[1/4] 2026-05-25 12:06:49 - [BGI Jiutian: Launched the first Argus 3DIC physical verification platform fully supports 2.5D/3D heterogeneous integrated packaging design] Huada Jiutian responded in Huayiyi that in terms of 3DIC, the company has forward-looking insights into the current
May 25, 2026 at 4:12 AM
[1/4] 2026-05-25 12:06:49 - [BGI Jiutian: Launched the first Argus 3DIC physical verification platform fully supports 2.5D/3D heterogeneous integrated packaging design] Huada Jiutian responded in Huayiyi that in terms of 3DIC, the company has forward-looking insights into the current
[4/4] platform, which fully supports 2.5D/3D heterogeneous integrated packaging design and can realize full-link physical verification from 3DIC diversified collaborative design to packaging.
May 20, 2026 at 12:21 PM
[4/4] platform, which fully supports 2.5D/3D heterogeneous integrated packaging design and can realize full-link physical verification from 3DIC diversified collaborative design to packaging.
[3/4] integrated 3D chip collaborative design to verification, filling the gap in domestic high-end 3DIC design tools, and is the only domestic 3DIC design verification full-process EDA provider. The company has newly launched the first industry-leading Argus3DIC physical verification
May 20, 2026 at 12:21 PM
[3/4] integrated 3D chip collaborative design to verification, filling the gap in domestic high-end 3DIC design tools, and is the only domestic 3DIC design verification full-process EDA provider. The company has newly launched the first industry-leading Argus3DIC physical verification
[2/4] insights into the current breakthroughs in AI, GPU, storage and other chips relying on 3DIC technology. Moore's era of advanced technology and computing power bottlenecks, early layout in the field of 3DIC design EDA, built a full-process solution covering heterogeneous
May 20, 2026 at 12:21 PM
[2/4] insights into the current breakthroughs in AI, GPU, storage and other chips relying on 3DIC technology. Moore's era of advanced technology and computing power bottlenecks, early layout in the field of 3DIC design EDA, built a full-process solution covering heterogeneous
[1/4] 2026-05-20 20:16:53 - [Huada Jiutian: The company’s Argus3DIC physical verification platform fully supports 2.5D/3D heterogeneous integrated packaging design] Huada Jiutian stated at the performance briefing on May 20 that in terms of 3DIC, the company has forward-looking
May 20, 2026 at 12:21 PM
[1/4] 2026-05-20 20:16:53 - [Huada Jiutian: The company’s Argus3DIC physical verification platform fully supports 2.5D/3D heterogeneous integrated packaging design] Huada Jiutian stated at the performance briefing on May 20 that in terms of 3DIC, the company has forward-looking
[3/5] institutions. According to Xinyuan Micro, the company has launched new products for temporary bonding and debonding equipment in recent years, and its contribution to revenue has continued to increase. With the expansion of client 2.5D, HBM, 3DIC, etc., product signing and
April 25, 2026 at 12:10 AM
[3/5] institutions. According to Xinyuan Micro, the company has launched new products for temporary bonding and debonding equipment in recent years, and its contribution to revenue has continued to increase. With the expansion of client 2.5D, HBM, 3DIC, etc., product signing and
Webinar Replay: Algorithm-Driven Physical Design Automation for 3D ICs by Dr. Sung Kyu Lim
Learn how AI & EDA automate the 3D design flow to solve thermal & routing challenges
🔗 https://bit.ly/4t6Kgwm
#3DIC #EDA #AIHardware #IntegratedCircuits #PhysicalDesign #Semiconductors
Learn how AI & EDA automate the 3D design flow to solve thermal & routing challenges
🔗 https://bit.ly/4t6Kgwm
#3DIC #EDA #AIHardware #IntegratedCircuits #PhysicalDesign #Semiconductors
April 15, 2026 at 5:00 PM
Webinar Replay: Algorithm-Driven Physical Design Automation for 3D ICs by Dr. Sung Kyu Lim
Learn how AI & EDA automate the 3D design flow to solve thermal & routing challenges
🔗 https://bit.ly/4t6Kgwm
#3DIC #EDA #AIHardware #IntegratedCircuits #PhysicalDesign #Semiconductors
Learn how AI & EDA automate the 3D design flow to solve thermal & routing challenges
🔗 https://bit.ly/4t6Kgwm
#3DIC #EDA #AIHardware #IntegratedCircuits #PhysicalDesign #Semiconductors