#3DNAND
2/4 G11 doubles storage density, raises I/O performance 50% versus current generation memory, and lowers power consumption. Wafer-on-wafer bonding underpins these targets. #3DNAND #Memory
October 26, 2026 at 5:30 PM
Micron's G11 3D NAND is still a 2027 story, but 400+ layers and wafer bonding point to a big jump in SSD density and efficiency.

#tech #technology #micron #3dnand #ssd #storage

techshowup.com/News/Article/…
Micron G11 3D NAND Targets Denser SSDs With 400+ Layers and Wafer Bonding
Micron’s G11 3D NAND points to the next big SSD capacity jump, pairing 400-plus layers with wafer bonding to raise density, speed, and efficiency from 2027 onward.
techshowup.com
October 23, 2026 at 9:16 PM
11月30日(月)10:10-17:10に、エレクトロニクス実装学会 #JIEP 北海道東北支部が「2026年北海道東北支部 見学会&先端半導体セミナー」を開催。午前は東北大学マイクロシステム融合研究開発センター(μSIC)の見学会、午後は講演3件。3次元積層技術を用いた3Dフラッシュメモリの技術動向と課題のほか、東北大学μSICと東京エレクトロンが登壇(演題は検討中)。先端パッケージング・ヘテロ集積化の技術コンソーシアム「T-CHIPS」の紹介も。→
#Seminar #Semiconductor #3DNAND
October 22, 2026 at 11:45 PM
3D NAND faces physics limits near 1000 layers, so the path forward is application-specific co-design beyond charge-trap flash. Which technology will win?
#NAND #3DNAND #$MU
chippub.substack.com/p/3d-nand-hi...
3D NAND Hits 1000 Layers: What's Next?
3D NAND faces physics limits near 1000 layers. Explore ferroelectric, 2D channel, and in-memory computing pathways for future scaling.
chippub.substack.com
October 19, 2026 at 6:56 AM
📰 YMTC Pasang Target Geser Samsung dan SK hynix untuk Jadi Produsen NAND Terbesar di Dunia pada 2027

👉 Baca artikel lengkap di sini: https://ahmandonk.com/2026/08/27/ymtc-targetkan-geser-samsung-dan-sk-hynix-jadi-produsen-nand-terbesar-2027/

#3dNand #hardwareKomputer #industriChip #nandFlash
August 27, 2026 at 7:29 AM
3dnand would be more space efficient, but it still leaves the question of why you would keep your memory there and not in ur head

(Yes I am taking this too seriously)
August 23, 2026 at 6:10 AM
📰 Sandisk Mulai Distribusikan Sampel BiCS10 1 Tb TLC, NAND 3D Generasi ke-10 untuk Era AI

👉 Baca artikel lengkap di sini: https://ahmandonk.com/2026/07/07/sandisk-bics10-1tb-tlc/

#3dN
an#3dNandb#ai1#bics10C#dataCenterr#enterpriseSsdF#nandFlashi#sandiska href="/hashtag/ssd" class="hover:underline text-blue-600 dark:text-sky-400 no-card-link">#ssd
July 7, 2026 at 1:18 PM
📰 Investasi Peralatan Fabrikasi Memori 300 mm Diproyeksikan Tembus US$50 Miliar pada 2026 Berkat Lonjakan AI

👉 Baca artikel lengkap di sini: https://ahmandonk.com/2026/06/30/investasi-peralatan-fabrikasi-memori-300mm-2026/

#3dN
an#3dNandd#aiC#dataCenter #ddr5 #drami#fabrication##hbmr#memory #semi
June 30, 2026 at 7:09 AM
📰 Transcend Luncurkan Solusi Penyimpanan 3D NAND 218-Layer untuk Komputasi AI dan Aplikasi Edge

👉 Baca artikel lengkap di sini: https://ahmandonk.com/2026/06/25/transcend-launches-218-layer-3d-nand-storage/

#218
-l#218 #3dNan#3dNand #aiot8#bics8e#gadgetu#kartuMemoriu#komputasiAin#perangkatKeras href="/hashtag/ss" class="hover:underline text-blue-600 dark:text-sky-400 no-card-link">#ss
June 25, 2026 at 4:26 AM
Pliops expands AI's context windows with 3D NAND-based accelerator – can accelerate certain inference workflows by up to eight times #Technology #EmergingTechnologies #ArtificialIntelligence #AI #3DNAND #TechInnovation
Pliops expands AI's context windows with 3D NAND-based accelerator – can accelerate certain inference workflows by up to eight times
Pliops claims its XDP LightningAI card and FusIOnX software accelerate large language model inference by offloading context data to SSDs, reducing redundant computation, and boosting vLLM throughput by...
puretech.news
May 16, 2025 at 11:03 AM
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Manufacturers are accelerating the development of higher-layer 3D NAND architectures

3dnand.com | fenand.com | #3DNAND

www.oscoo.com/news/nand-fl...
NAND Flash May Face a Decade-Long Shortage - OSCOO
Phison Electronics’ CEO recently warned in an interview with foreign media that NAND flash memory may face a long-term shortage over the next decade. This is not merely a short-term price fluctuation ...
www.oscoo.com
June 27, 2026 at 8:39 AM
SanDisk Bets on Stacking NAND and Compute on One Chip as HBM Shortages Choke the AI Boom

3dcircuits.com | 3dnand.com | #3DCircuits | #3DNAND

wccftech.com/sandisk-bets...
SanDisk Bets on Stacking NAND and Compute on One Chip as HBM Shortages Choke the AI Boom
SanDisk is looking for more innovative solutions to address memory limitations, such as stacking NAND Flash within chips.
wccftech.com
June 22, 2026 at 6:17 AM