AMD pushes server limits: EPYC 9006 Venice arrives with 256 Zen 6 cores and a new I/O Die supporting PCIe Gen6 and MRDIMM memory at 12,800 MT/sec. A massive leap for AI infrastructure.

米国際貿易委員会は、ネットリストがマイクロン・テクノロジーなどの<a href="https://tech-matome.com//?tag=ddr5">DDR5</a>サーバー向けメモリ製品を巡り申し立てた特許侵害について、関税法に基づく調査を開始しました。 ネットリストは対象製品の米国への輸入制限などを求めていますが、今回の調査開始は侵害の認定を意味するものではなく、現時点で製品の輸入や販売が直ちに停止されることはありません。 対象となった製品は<a href="https://tech-matome.com//?tag=ai">AI</a>やデータセンターなどで使用されるDDR5 RDIMMやMRDIMMであり、マイクロンは次世代の高速大容量メモリの開発と量産化を進めています。 ネットリストは最近サムスン電子と大規模な特許ライセンス契約を締結して係争を包括的に解決しており、マイクロンとも過去に特許侵害を巡る巨額の損害賠償評決を争った経緯があります。 今後は行政法判事による審理や証拠審理を経て特許侵害の有無が判断され、委員会の最終的な決定や今後の調査日程に業界の注目が集まっています。

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MicronのDDR5-8800 MRDIMM「MTC20F2085S1HC88XD1」の取り扱いが、オリオスペックで始まっている。

MicronのDDR5-8800 MRDIMM「MTC20F2085S1HC88XD1」の取り扱いが、オリオスペックで始まっている。

AKIBA PC Hotline!

Netlist is trying to turn a patent fight with Micron into a border problem, and it comes at the worst possible moment for anyone buying AI memory. Netlist announced on August 12 that it had gone to the US International Trade Commission against Micron, Supermicro, HPE and Lenovo, asking for exclusion and cease-and-desist orders tied to four patents covering DDR5 RDIMM and MRDIMM memory. You don't need to follow every patent docket to see the point. These are the memory modules that sit inside the servers feeding the AI buildout, and Netlist is asking for a remedy that can stop allegedly infringing products from entering the United States. That is the sharp edge here. A normal patent suit can end in damages, licensing fees, appeals and years of lawyerly delay. An ITC exclusion order is different because US Customs and Border Protection enforces it at the border. Netlist's own release says Micron manufactures the accused memory products overseas, which is why the company is pushing the fight through a trade venue rather than only through district court. Netlist's complaint names US Patent Nos. 10,025,731, 10,217,523, 12,373,366 and 12,675,407. The company also filed a parallel case against Micron in the US...

Learn how MRDIMM uses multiplexed rank architecture to increase DDR5 server memory bandwidth, with speeds reaching 12,800 MT/s and beyond.

Zen 7 is confirmed to support next-generation memory technologies, specifically MRDIMM and LPDDR variants (such as LPDDR5X), while EPYC "Florence" server chips will likely remain on DDR5 standards. It...

Renesas updates MRDIMM to address memory bottlenecks in AI data centers and accelerated compute workloads, enhancing DDR5 performance for AI infrastructure.

ルネサス エレクトロニクスは、第3世代DDR5サーバ用MRDIMM（マルチプレックスド・ランク・デュアル・インライン・メモリ・モジュール）向けに、最大16000MT/s（メガトランスファ/秒）の高速データ転送を実現するメモリインタフェースチップセットを発表した。

Renesas’ Gen 3 DDR5 MRDIMM attacks AI’s memory choke point with 16,000 MT/s bandwidth and no platform overhaul.

Here’s a roundup of this week’s must-read articles. We'll look into the latest developments on fault-tolerant quantum computers, why sustained performance will define the next phase of edge AI, and a partnership on agentic AI for EDA to automate complex engineering tasks. Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website. NEWS Renesas Upgrades DDR5 MRDIMM Chipset Gen 3 DDR5 MRDIMM chipset delivers speeds up to 16,000 MT/s. TDK, LG Innotek Collaborate on Physical AI Solutions&hellip;

日本Renesas瑞薩半導體宣布推出第3代DDR5 MRDIMM晶片組解決方案，將DDR5 MRDIMM的性能一舉提升至16,000MT/s，為AI資料中心、雲端基礎設施與加速運算等高階運算帶來更高的記憶體頻寬。延續DDR5基礎架構進一步提升頻寬▲瑞薩第三代DDR5 MRDIMM晶片組在延續DDR5基礎架構下較第1代方案幾乎翻倍Renesas的第3代DDR5 MRDIMM晶片組解決方案由兩部分組成，包括第3代多工暫存器時脈驅動器(MRCD)，以及多路復用資料緩衝區(MDB)。相較第2代DDR5 MRDIMM晶片解決方案，在同樣基於DDR5基礎架構下，頻寬提高25%，相對第1代解決方案幾乎翻倍，

Renesas Electronics Corp. has launched its third‑generation (Gen 3) DDR5 multiplexed rank dual in‑line memory module (MRDIMM) chipset solutions with server-class MRDIMM speeds up to 16,000 mega transfers per second (MT/s). The new devices include the RRG5013 multiplexed registering clock driver (MRCD) and RRG5103 multiplexed data buffer (MDB). Targeting increased demand for higher memory bandwidth driven by AI data centers, cloud infrastructure, and accelerated compute workloads, the Gen 3 MRDIMM solutions deliver 25% higher memory bandwidth than its second-generation solutions, while continuing to use existing DDR5 infrastructure. The MRDIMM platform includes MRCD, MDB, power management ICs, serial presence detect hubs, and temperature sensors.