Eliyan Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today revealed the successful delivery of first silicon for its NuLink -2.0 PHY, manufactured in a 3 nm process. The device achieves 64 Gbps/bump, the industry's highest performance for a die-to-die PHY solution for multi-die architectures. While compatible with UCIe standard, the milestone further confirms Eliyan's ability to extend die-to-die connectivity by 2x higher bandwidth, on standard as well as advanced packaging, at unprecedented power, area, and latency. The NuLink-2.0 is a multi-mode PHY solution that also supports UMI (Universal Memory Interconnect), a novel chiplet interconnect technology that improves Die-to-Memory bandwidth efficiency by more than 2x. UMI leverages a dynamic bidirectional PHY whose specifications are currently being finalized with the Open Compute Project (OCP) as BoW 2.1. Read full story