Soitec, a global leader in the design and manufacture of cutting-edge semiconductor materials, has announced a strategic partnership with Powerchip Semiconductor Manufacturing Corporation (PSMC). As part of this collaboration, Soitec will provide PSMC with 300mm substrates featuring an integrated release layer, making them Transistor Layer Transfer (TLT) ready. These substrates will serve as the foundation for a new demonstration of advanced wafer-level 3D chip stacking.