I've been watching $IBM: IBM needs N3/N3E chiplets + CoWoS HBM3E; TSV thermal risk.
October 1, 2026 at 1:05 PM
I've been watching $IBM: IBM needs N3/N3E chiplets + CoWoS HBM3E; TSV thermal risk.
Watching $NXPI: NXP moving to N3 chiplets, SiP; TSV therml risk analysi. https://www.marketscreener.com/news/nxp-semiconductors-breaks-ground-on-site-expansion-project-in-malaysia-ce7859d8dc88f62d
September 30, 2026 at 9:04 PM
Watching $NXPI: NXP moving to N3 chiplets, SiP; TSV therml risk analysi. https://www.marketscreener.com/news/nxp-semiconductors-breaks-ground-on-site-expansion-project-in-malaysia-ce7859d8dc88f62d
RDNA 5 Flagship Has STACKED CHIPLETS?! Specs & Analysis Of AT0 & AT2 Leaks
YouTube video by RedGamingTech
youtu.be
September 30, 2026 at 7:49 PM
Barred from TSMC, Huawei has turned to stacking chiplets via a logic-folding technique — and new AI chips are now closing on Nvidia's performance.
Bit-Rauschen: Huaweis Logic-Folding-Technik und neue KI-Konkurrenz für Nvidia
Huawei stapelt Chiplets, weil man nicht bei TSMC einkaufen darf. Der KI-Boom beschert EU-Firmen Aufwind. Neue KI-Chips rücken dichter an die von Nvidia heran.
newsletter.heise.de
September 30, 2026 at 10:18 AM
Barred from TSMC, Huawei has turned to stacking chiplets via a logic-folding technique — and new AI chips are now closing on Nvidia's performance.
Zikun Li, Zhuoming Chen, Zhihao Jia: QBX: A Compiler for 2-local Qubit Hamiltonian Simulation on Quantum Chiplets https://arxiv.org/abs/2609.33997 https://arxiv.org/pdf/2609.33997 https://arxiv.org/html/2609.33997
September 30, 2026 at 7:00 AM
Zikun Li, Zhuoming Chen, Zhihao Jia: QBX: A Compiler for 2-local Qubit Hamiltonian Simulation on Quantum Chiplets https://arxiv.org/abs/2609.33997 https://arxiv.org/pdf/2609.33997 https://arxiv.org/html/2609.33997
heise+ | Bit-Rauschen: Huaweis Logic-Folding-Technik und neue KI-Konkurrenz für Nvidia www.heise.de/hintergrund/...
Bit-Rauschen: Huaweis Logic-Folding-Technik und neue KI-Konkurrenz für Nvidia
Huawei stapelt Chiplets, weil man nicht bei TSMC einkaufen darf. Der KI-Boom beschert EU-Firmen Aufwind. Neue KI-Chips rücken dichter an die von Nvidia heran.
www.heise.de
September 29, 2026 at 5:47 PM
heise+ | Bit-Rauschen: Huaweis Logic-Folding-Technik und neue KI-Konkurrenz für Nvidia www.heise.de/hintergrund/...
RDNA 5 mit Compute-Chiplets?: Erst hieß es erneut „Ja“, dann doch wieder „Nein“
RDNA 5 mit Compute-Chiplets?: Erst hieß es erneut „Ja“, dann doch wieder „Nein“
Teilt AMD bei RDNA 5 erstmals auch die zentrale Recheneinheit auf mehrere Chips auf? Vor einer Woche hieß es „Ja“, dann doch wieder „Nein“.
www.computerbase.de
September 29, 2026 at 11:33 AM
RDNA 5 mit Compute-Chiplets?: Erst hieß es erneut „Ja“, dann doch wieder „Nein“
QBX: A Compiler for 2-local Qubit Hamiltonian Simulation on Quantum Chiplets
https://arxiv.org/pdf/2609.33997
Zikun Li, Zhuoming Chen, Zhihao Jia.
https://arxiv.org/pdf/2609.33997
Zikun Li, Zhuoming Chen, Zhihao Jia.
https://arxiv.org/abs/2609.33997
arXiv abstract link
arxiv.org
September 29, 2026 at 7:33 AM
QBX: A Compiler for 2-local Qubit Hamiltonian Simulation on Quantum Chiplets
https://arxiv.org/pdf/2609.33997
Zikun Li, Zhuoming Chen, Zhihao Jia.
https://arxiv.org/pdf/2609.33997
Zikun Li, Zhuoming Chen, Zhihao Jia.
Zikun Li, Zhuoming Chen, Zhihao Jia: QBX: A Compiler for 2-local Qubit Hamiltonian Simulation on Quantum Chiplets https://arxiv.org/abs/2609.33997 https://arxiv.org/pdf/2609.33997 https://arxiv.org/html/2609.33997
September 29, 2026 at 7:00 AM
Zikun Li, Zhuoming Chen, Zhihao Jia: QBX: A Compiler for 2-local Qubit Hamiltonian Simulation on Quantum Chiplets https://arxiv.org/abs/2609.33997 https://arxiv.org/pdf/2609.33997 https://arxiv.org/html/2609.33997
Watching $NVDA: NVIDIA bets N3E chiplets + CoWoS HBM3E; tensor core microarch gives perf/W edge. TSV thermal yield mispriced. analysi efficency
September 28, 2026 at 8:03 PM
Watching $NVDA: NVIDIA bets N3E chiplets + CoWoS HBM3E; tensor core microarch gives perf/W edge. TSV thermal yield mispriced. analysi efficency
As designers split one large die into chiplets, more of the interconnect moves off the chip and into the package — so the substrate gets bigger, denser and harder to build.
September 28, 2026 at 8:01 AM
As designers split one large die into chiplets, more of the interconnect moves off the chip and into the package — so the substrate gets bigger, denser and harder to build.
Huawei stapelt Chiplets, weil man nicht bei TSMC einkaufen darf. Der KI-Boom beschert EU-Firmen Aufwind. Neue KI-Chips rücken dichter an die von Nvidia heran. #Bit-Rauschen
heise+ | Bit-Rauschen: Huaweis Logic-Folding-Technik und neue KI-Konkurrenz für Nvidia
Huawei stapelt Chiplets, weil man nicht bei TSMC einkaufen darf. Der KI-Boom beschert EU-Firmen Aufwind. Neue KI-Chips rücken dichter an die von Nvidia heran.
www.heise.de
September 28, 2026 at 5:03 AM
Huawei stapelt Chiplets, weil man nicht bei TSMC einkaufen darf. Der KI-Boom beschert EU-Firmen Aufwind. Neue KI-Chips rücken dichter an die von Nvidia heran. #Bit-Rauschen
"Glass Packaging for Chiplets Heterogeneous Integration", John Lau, Unimicron, J of Microele & Ele Pkg, 26-09-15 imapsjmep.org/article/1699...
<= IEEE SCV EPS Lecture, 09-24 bsky.app/profile/ogaw...
Slides URL (80 pp) r6.ieee.org/scv-eps/wp-c...
τ -Law & Glass, 电子与封装, 07-06 bsky.app/profile/ogaw...
<= IEEE SCV EPS Lecture, 09-24 bsky.app/profile/ogaw...
Slides URL (80 pp) r6.ieee.org/scv-eps/wp-c...
τ -Law & Glass, 电子与封装, 07-06 bsky.app/profile/ogaw...
September 27, 2026 at 1:31 AM
"Glass Packaging for Chiplets Heterogeneous Integration", John Lau, Unimicron, J of Microele & Ele Pkg, 26-09-15 imapsjmep.org/article/1699...
<= IEEE SCV EPS Lecture, 09-24 bsky.app/profile/ogaw...
Slides URL (80 pp) r6.ieee.org/scv-eps/wp-c...
τ -Law & Glass, 电子与封装, 07-06 bsky.app/profile/ogaw...
<= IEEE SCV EPS Lecture, 09-24 bsky.app/profile/ogaw...
Slides URL (80 pp) r6.ieee.org/scv-eps/wp-c...
τ -Law & Glass, 电子与封装, 07-06 bsky.app/profile/ogaw...
One interesting scenario if the industry becomes modular:
#$RGTI doesn't necessarily need to win as a full quantum-computer vendor.
It could potentially monetize QPUs, chiplets or control hardware as components inside someone else's system.
#$RGTI doesn't necessarily need to win as a full quantum-computer vendor.
It could potentially monetize QPUs, chiplets or control hardware as components inside someone else's system.
September 24, 2026 at 10:50 AM
One interesting scenario if the industry becomes modular:
#$RGTI doesn't necessarily need to win as a full quantum-computer vendor.
It could potentially monetize QPUs, chiplets or control hardware as components inside someone else's system.
#$RGTI doesn't necessarily need to win as a full quantum-computer vendor.
It could potentially monetize QPUs, chiplets or control hardware as components inside someone else's system.
Chiplets Market to Reach US$ 322.09 Billion by 2033
Read More:
https://beeswire.com/chiplets-market-to-reach-us-322-09-billion-by-2033/
Read More:
https://beeswire.com/chiplets-market-to-reach-us-322-09-billion-by-2033/
Chiplets Market to Reach US$ 322.09 Billion by 2033
The chiplets industry plays a vital role in advancing next-generation semiconductor design, enabling manufacturers to combine modular, specialized dies into a single package for improved performance, yield, and cost efficiency. Surging AI computing demand and expanding adoption of advanced packaging technologies are strengthening demand for chiplets worldwide. According to Business Market Insights, the Chiplets Market…
beeswire.com
September 22, 2026 at 12:59 PM
Chiplets Market to Reach US$ 322.09 Billion by 2033
Read More:
https://beeswire.com/chiplets-market-to-reach-us-322-09-billion-by-2033/
Read More:
https://beeswire.com/chiplets-market-to-reach-us-322-09-billion-by-2033/
Beyond the Monolith: Multi-Die Assembly and the Architecture of the 2nm Era
Explore how multi-die assemblies and chiplets are replacing monolithic designs at 2nm and below to overcome physical scaling limits and power density challenges
#ChipDesign #2nm
Read more →
Explore how multi-die assemblies and chiplets are replacing monolithic designs at 2nm and below to overcome physical scaling limits and power density challenges
#ChipDesign #2nm
Read more →
Beyond the Monolith: Multi-Die Assembly and the Architecture of the 2nm Era
Explore how multi-die assemblies and chiplets are replacing monolithic designs at 2nm and below to overcome physical scaling limits and power density challenges
calmvibez.com
September 21, 2026 at 12:52 PM
Beyond the Monolith: Multi-Die Assembly and the Architecture of the 2nm Era
Explore how multi-die assemblies and chiplets are replacing monolithic designs at 2nm and below to overcome physical scaling limits and power density challenges
#ChipDesign #2nm
Read more →
Explore how multi-die assemblies and chiplets are replacing monolithic designs at 2nm and below to overcome physical scaling limits and power density challenges
#ChipDesign #2nm
Read more →
Watching HPE ($HPE): 4nm CFET chiplets + CoWoS HBM3E; SRAM/EUV yield capping. https://finance.yahoo.com/technology/ai/articles/hewlett-packard-enterprise-sees-ai-010159162.html
September 20, 2026 at 1:01 PM
Watching HPE ($HPE): 4nm CFET chiplets + CoWoS HBM3E; SRAM/EUV yield capping. https://finance.yahoo.com/technology/ai/articles/hewlett-packard-enterprise-sees-ai-010159162.html
I've been watching $HPE: HPE will push 4nm CFET chiplets + CoWoS HBM3E for AI throughput; SRAM variability and EUV overlay yield will cap margins - play supply arbitrage. https://finance.yahoo.com/technology/ai/articles/hewlett-packard-enterprise-sees-ai-010159162.html
September 19, 2026 at 9:02 PM
I've been watching $HPE: HPE will push 4nm CFET chiplets + CoWoS HBM3E for AI throughput; SRAM variability and EUV overlay yield will cap margins - play supply arbitrage. https://finance.yahoo.com/technology/ai/articles/hewlett-packard-enterprise-sees-ai-010159162.html
=>
OpenAI OpCo, Appls
Clive Chan, Richard Ho, & bsky.app/profile/ogaw...
Non-adjacent Connection of HBM Chiplets (Oct 2024)
Hardware Accelerators for Transformer Key-Value Cache ( Dec 2024)
OpenAI OpCo, Appls
Clive Chan, Richard Ho, & bsky.app/profile/ogaw...
Non-adjacent Connection of HBM Chiplets (Oct 2024)
Hardware Accelerators for Transformer Key-Value Cache ( Dec 2024)
OpenAI OpCo, Appls
Clive Chan, Richard Ho, &
Non-adjacent Connection of HBM Chiplets (Oct 2024) bsky.app/profile/ogaw...
<= Accelerators for Transformer Key-Value Caches (Dec 2024) bsky.app/profile/ogaw...
(DRAM + PIM ALU) HBM Stack + Base die ALU
In-Memory Computing, Appls (Originally by Rain AI)
Clive Chan, Richard Ho, &
Non-adjacent Connection of HBM Chiplets (Oct 2024) bsky.app/profile/ogaw...
<= Accelerators for Transformer Key-Value Caches (Dec 2024) bsky.app/profile/ogaw...
(DRAM + PIM ALU) HBM Stack + Base die ALU
In-Memory Computing, Appls (Originally by Rain AI)
September 19, 2026 at 11:17 AM
=>
OpenAI OpCo, Appls
Clive Chan, Richard Ho, & bsky.app/profile/ogaw...
Non-adjacent Connection of HBM Chiplets (Oct 2024)
Hardware Accelerators for Transformer Key-Value Cache ( Dec 2024)
OpenAI OpCo, Appls
Clive Chan, Richard Ho, & bsky.app/profile/ogaw...
Non-adjacent Connection of HBM Chiplets (Oct 2024)
Hardware Accelerators for Transformer Key-Value Cache ( Dec 2024)
もなちゃんCPU
wccftech.com/fujitsus-mon...
wccftech.com/fujitsus-mon...
Fujitsu's Monaka Chip 3D Stacks 2nm "144-Core CPU" With 5nm "SRAM" Dies While Monaka-X Eyes 2029 Release on 1.4nm & NVLink Fusion
Fujitsu's Monaka CPU launches in 2027 with 144 cores, 2.9 GHz, 500W TDP, & 2x AI performance using Arm v9.3-A architecture and 3D chiplets.
wccftech.com
September 18, 2026 at 4:44 AM
もなちゃんCPU
wccftech.com/fujitsus-mon...
wccftech.com/fujitsus-mon...
=>
3.5D Heterogeneous Scale-In, H. Bharadwaj, Broadcom, Chiplets & Adv Packaging, OCP APAC Summit, 26-08-11 www.youtube.com/watch?v=gy5j...
drive.google.com/file/d/1tzrO...
IanCutress, 08-31 x.com/IanCutress/s...
MONAKA, HC '26 chipsandcheese.com/p/hot-chips-...
3DIC, TSMC bsky.app/profile/ogaw...
3.5D Heterogeneous Scale-In, H. Bharadwaj, Broadcom, Chiplets & Adv Packaging, OCP APAC Summit, 26-08-11 www.youtube.com/watch?v=gy5j...
drive.google.com/file/d/1tzrO...
IanCutress, 08-31 x.com/IanCutress/s...
MONAKA, HC '26 chipsandcheese.com/p/hot-chips-...
3DIC, TSMC bsky.app/profile/ogaw...
September 18, 2026 at 1:33 AM
=>
3.5D Heterogeneous Scale-In, H. Bharadwaj, Broadcom, Chiplets & Adv Packaging, OCP APAC Summit, 26-08-11 www.youtube.com/watch?v=gy5j...
drive.google.com/file/d/1tzrO...
IanCutress, 08-31 x.com/IanCutress/s...
MONAKA, HC '26 chipsandcheese.com/p/hot-chips-...
3DIC, TSMC bsky.app/profile/ogaw...
3.5D Heterogeneous Scale-In, H. Bharadwaj, Broadcom, Chiplets & Adv Packaging, OCP APAC Summit, 26-08-11 www.youtube.com/watch?v=gy5j...
drive.google.com/file/d/1tzrO...
IanCutress, 08-31 x.com/IanCutress/s...
MONAKA, HC '26 chipsandcheese.com/p/hot-chips-...
3DIC, TSMC bsky.app/profile/ogaw...
$IBM, IBM dual-arch mainframe on 3nm CFET chiplets+CoWoS HBM3E; yield caps. https://ca.finance.yahoo.com/news/rocket-software-launches-rocket-z-123300981.html
September 17, 2026 at 8:03 PM
$IBM, IBM dual-arch mainframe on 3nm CFET chiplets+CoWoS HBM3E; yield caps. https://ca.finance.yahoo.com/news/rocket-software-launches-rocket-z-123300981.html
$7 chiplets
September 16, 2026 at 4:43 PM
$7 chiplets
AMD sort le Ryzen 5 5500F, un Zen 3 en chiplets qui se frotte à ses cousins AM4. +7,3 % de fps vs le 5500, +8,4 % vs le 3600 selon RandomGaminginHD. À 109 euros, c'est un vrai contrepoint sur un socket qu'on croyait mort.
Le Ryzen 5 5500F se frotte à d’autres Ryzen AM4 dans quelques jeux
Il y a quelques jours, AMD a enrichi son catalogue AM4 en y ajoutant le Ryzen 5 5500F. Quelques comparaisons disponibles sur la chaîne RandomGaminginHD nous apportent un premier aperçu de ses prestations vidéoludiques. Zen 3 et même Zen 2 de retour sur scène En préambule, rappelo
www.comptoir-hardware.com
September 16, 2026 at 10:45 AM
AMD sort le Ryzen 5 5500F, un Zen 3 en chiplets qui se frotte à ses cousins AM4. +7,3 % de fps vs le 5500, +8,4 % vs le 3600 selon RandomGaminginHD. À 109 euros, c'est un vrai contrepoint sur un socket qu'on croyait mort.