Provides non-destructive 3D analysis of the location, morphology, and depth profile of internal defects in glass substrates Introduces TAMI, a dedicated 3D analysis software platform that connects R&D analysis with production-line review Accelerates root-cause analysis and yield learning for glass substrates, a key material for next-generation advanced packaging DAEJEON, South Korea, July 13, 2026 /PRNewswire/ — Tomocube, a 3D non-destructive inspection and metrology company, today announced the launch of HT-T1 Desktop (HT-T1D), a desktop holotomography system for high-resolution 3D defect analysis of glass substrates used in next-generation semiconductor packaging. HT-T1D is optimized for glass-substrate inspection and metrology workflows. When conventional […]