Synopsys has combined Ansys multiphysics simulation technologies with its industry-leading EDA portfolio and AI-driven optimization The post Multiphysics moves to the heart of semiconductor design as Synopsys brings multiphysics into the chip-design workflow appeared first on Physics World.

Multiphysics Software is becoming an essential tool for industries that require advanced engineering simulations and accurate design analysis. It allows engineers to study multiple physical phenomena, such as heat transfer, fluid flow, structural mechanics, and electromagnetics, within a single simulation environment. Multiphysics Software Market Overview The Multiphysics Software Market is gaining importance as industries increasingly adopt advanced simulation technologies to analyze complex physical interactions and improve product development.

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Vancouver, British Columbia--(Newsfile Corp. - November 4, 2026) - Americas Uranium Corp. (CSE: NUCA) (OTC Pink: ASRFF) (FSE: WA7) (the "Company" or "Americas Uranium") is pleased to announce that its consultant, Axiom Exploration Group Ltd., has completed the Multiphysics integration of TDEM, ground gravity and magnetic survey results with the structural lineament and probability analysis, resulting in the identification of three priority target areas to follow-up with a diamond drill program...

Advances in sensing, manufacturing, computational resources, and data-driven methods are enabling new approaches to electromagnetic sensing, non-destructive evaluation, and advanced materials processing. This webinar will demonstrate how the COMSOL Multiphysics software supports predictive modeling by coupling electromagnetic fields with thermal, chemical, mechanical, and transport phenomena across multiple length and time scales. The first application we will show focuses on eddy-current thermometry for reconstructing three-dimensional temperature fields in metal plates. Temperature-dependent electrical conductivity alters induced currents and magnetic fields, enabling volumetric thermal inference. COMSOL simulations of defects and laser-induced transient heating will support validation of reconstruction algorithms. Multifrequency excitation will be investigated to improve depth discrimination through frequency-dependent penetration depths and sensitivities. The second application examines microwave-enabled volumetric additive manufacturing of ceramic components. A high-power microwave beamforming array delivers localized energy into three-dimensional volumes, enabling processing of opaque, particle-laden resins. Coupled COMSOL models of electromagnetic propagation, microwave absorption, heat transfer, and ceramic sintering kinetics are used to predict temperature evolution, reaction progression, spatial resolution, and processing scalability. Future extensions will incorporate pulsed excitation, fluid flow, resin viscosity, convection, shrinkage, and solid mechanics. Together, these examples demonstrate how the COMSOL software can integrate multiphysics modeling with sensing, manufacturing, and data inversion. This webinar will present two applications of coupled electromagnetic and thermal modeling in COMSOL Multiphysics: eddy-current thermometry in metal plates and microwave-assisted processing of ceramic-loaded resins. By connecting simulation with practical engineering systems, COMSOL-based modeling can accelerate technology development, reduce experimental iteration, and support reliable scale-up of next-generation electromagnetic technologies. Register now for this free webinar!

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California startup Nebula has shown a flat 3D printed motor stator built with its multi-material inkjet Fabricator, which jets 4 picolitre droplets from over 1,000 nozzles. The design was optimised by an AI harness driving multiphysics simulations, and the firm's first commercial focus is printed circuit boards. https://3dprinting.com/news/nebula-shows-early-3d-printed-motor-stator-from-its-electronics-fabricator/ #3Dprint #3Dprinting #Electronics