But blazing fast data speeds come with significant manufacturing challenges.

Sarcina Technology, a leader in semiconductor and photonic package design, has unveiled significant advancements in its photonic packaging capabilities for Co-Packaged Optics (CPO), targeting core challenges faced by data centers amid the exponential growth of AI-driven data. Sarcina’s innovative approach to photonic package design is setting the stage for a new generation of high-bandwidth, high-data-rate, and low-power interconnects. As traditional copper interconnects struggle to meet the performance, power, and density demands of next-generation…

How NPO, CPO, and optical chiplets are redrawing the economics and supply chains of AI connectivity

NVIDIA CEO Jensen Huang has expressed doubts about optical chip reliability.

AI×チップレット×光電融合×ガラスサブストレートが拓く次世代半導体パッケージ戦略 part.1 | グローバルネット株式会社はあらゆる半導体関連情報を提供いたします。エッチング／バンプウエハ／CMPなどのウエハ受託加工、世界半導体市場年鑑／世界半導体製造装置市場年鑑を始めとした半導体、有機ELの調査レポートの販売を行っております。

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Onsemi's Treo Platform, Co-Packaged Optics, and Time Sensitive Networking! Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website. NEWS Alice & Bob Unveils Dynamiqs-NVIDIA CUDA-Q Synergy, Pushing Quantum Simulation Speeds to New Heights…

The insatiable hunger for interconnection bandwidth is one of the key trends shaping data centers’ evolution, driven by the unstoppable growth of Internet traffic and the aggressive scaling of AI Large Language Models. Increased bandwidth, however, usually comes at the price of increased power, definitely an unwanted side effect in the era of skyrocketing data centers’ energy consumption: it’s worth reminding that a single Nvidia rack is expected to draw as much as 600 kilowatts in 2027.

AMD has announced the acquisition of Enosemi, a strategic move aimed at accelerating innovation in co-packaged optics for next-generation AI systems. This acquisition represents a pivotal advancement in AMD’s fast-evolving AI roadmap. Enosemi, having previously worked with AMD as an external development partner in the photonics domain, now formally joins the company to expand AMD’s internal capabilities. As part of AMD, Enosemi’s team will play a central role in scaling the development and deployment of photonics and co-packaged optics solutions to meet the demands of emerging AI infrastructure.