Delft University of Technology (@tudelft.nl) is hiring:
Postdoc for E2Packman

#postdoc #engineering #electronicpackaging

Our recent issue explores interesting topics such as wireless clock synchronization, AI long-term memory, and breaking the barrier of 200 Gb/s.

Learn more: bit.ly/4wClsxk

#ClockSynchronization #ElectronicPackaging #AI

🎯TOPICAL REVIEW in #IJEM

"Ceramic particles reinforced copper matrix composites manufactured by advanced powder metallurgy: preparation, performance, and mechanisms"
🔗 doi.org/10.1088/2631-7990/acdb0b

#CopperComposites #PowderMetallurgy #MaterialsScience #ThermalManagement #ElectronicPackaging

(13) 📦 Electronic Packaging Market: Driving the Next Generation of Semiconductors & Smart Electronics | LinkedIn www.linkedin.com/pulse/electr... #ElectronicPackaging #ElectronicsPackaging #SemiconductorPackaging #ElectronicComponents #AdvancedPackaging #ElectronicsIndustry

11月10日(火)-12日(木)に、 #IEEE と IEE Electronics Packaging Society #EPS が “15th IEEE #CPMT Symposium Japan” #ICSJ2026 を開催。テーマは “Challenge of Advanced Packaging for AI / Data Center and its Utilization Technology”。京都市中京区・立命館大学にて。アブストラクト投稿締切は5月29日。詳細は buff.ly/OjgkevN に。
#Symposium #ElectronicPackaging

3月10日(火)-12日(木)に、エレクトロニクス実装学会 #JIEP が第40回春季講演大会を開催。東京都八王子市・東京都立多摩産業交流センター (東京たま未来メッセ) およびオンラインにて。詳細は buff.ly/1Bkv44F に。
#Conference #ElectronicPackaging

12月3日(水)12:00-15:00に、エレクトロニクス実装学会 #JIEP が第71回教育セミナー『日米最先端エレクトロニクス実装教育セミナー』をオンライン開催。講演4件。詳細は buff.ly/loUp79P に。
#Seminar #Education #ElectronicPackaging

11月12日(水)-14日(金)に、 #IEEE と IEE Electronics Packaging Society #EPS が "14th IEEE #CPMT Symposium Japan" #ICSJ2025 を開催。メインテーマは、“Advanced Electronics Packaging Technology for Digital Twin”。京都市中京区・立命館大学朱雀キャンパスにて。詳細は bit.ly/4dZjDlC に。
#Symposium #ElectronicPackaging

6月27日に #IMAPS がジャーナル Journal of Microelectronics and Electronic Packaging #JMEP の最新号 (Vol. 22, Issue 2, 2025) を公開。発表は bit.ly/4khyLgz に、本文は bit.ly/446Eb9l から。
#Journal #Microelectronics #ElectronicPackaging

4月8日に #IMAPS がジャーナル Journal of Microelectronics and Electronic Packaging #JMEP の最新号 (Vol. 21, Issue 1, 2025) を公開。発表は bit.ly/3RcGH6N に、本文は bit.ly/4jiWI7i から。
#Journal #Microelectronics #ElectronicPackaging

Electronic Packaging Market Research, Size, Share, Trends & Analysis, 2035 www.marketresearchfuture.com/reports/elec...

#ElectronicPackaging #Semiconductors #ChipPackaging #AdvancedPackaging #ElectronicsManufacturing #ICPackaging #TechIndustry

Electronic Packaging Market is Transforming the Industry Landscape www.marketresearchfuture.com/reports/elec...
#ElectronicPackaging #SemiconductorPackaging #ChipDesign #AdvancedMaterials #ElectronicsIndustry #Miniaturization #MarketGrowth #Innovation #TechIndustry #PCB

Wire Bonding Market Growth Analysis and Strategic Insights 2026 www.marketresearchfuture.com/reports/wire...
#WireBonding #SemiconductorManufacturing #ElectronicPackaging #AdvancedManufacturing #SmartTech

#World #Television #Day: #Connecting the World
tinyurl.com/yrnw7nn8
#WorldTelevisionDay #CustomBoxGuru #ElectronicPackaging #TVPackaging #ConnectingWorlds #GlobalCommunication