IEEE JxCDC
3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency
Read the full article on IEEE Xplore here: https://bit.ly/4dcP8ey
#IEEESSCS #LLM #HBM #3DStacking #AIHardware #Semiconductors #GeorgiaTech #JxCDC
3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency
Read the full article on IEEE Xplore here: https://bit.ly/4dcP8ey
#IEEESSCS #LLM #HBM #3DStacking #AIHardware #Semiconductors #GeorgiaTech #JxCDC
March 31, 2026 at 6:13 PM
IEEE JxCDC
3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency
Read the full article on IEEE Xplore here: https://bit.ly/4dcP8ey
#IEEESSCS #LLM #HBM #3DStacking #AIHardware #Semiconductors #GeorgiaTech #JxCDC
3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency
Read the full article on IEEE Xplore here: https://bit.ly/4dcP8ey
#IEEESSCS #LLM #HBM #3DStacking #AIHardware #Semiconductors #GeorgiaTech #JxCDC
Publication: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits (JxCDC)
Article: Beyond Backside Power: Backside Signal Routing as Technology Booster for Standard-Cell Scaling
Read the full article now on IEEE Xplore: https://ieeexplore.ieee.org/document/11192533
#JxCDC
Article: Beyond Backside Power: Backside Signal Routing as Technology Booster for Standard-Cell Scaling
Read the full article now on IEEE Xplore: https://ieeexplore.ieee.org/document/11192533
#JxCDC
April 30, 2026 at 10:15 PM
Publication: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits (JxCDC)
Article: Beyond Backside Power: Backside Signal Routing as Technology Booster for Standard-Cell Scaling
Read the full article now on IEEE Xplore: https://ieeexplore.ieee.org/document/11192533
#JxCDC
Article: Beyond Backside Power: Backside Signal Routing as Technology Booster for Standard-Cell Scaling
Read the full article now on IEEE Xplore: https://ieeexplore.ieee.org/document/11192533
#JxCDC
Top 3 most-cited articles from JxCDC
#1 - https://bit.ly/4ba29BH
#2 - https://bit.ly/499zsmw
#3 - https://bit.ly/3EhWzOI
#IEEE #SSCS #JxCDC #Research #Engineering
#1 - https://bit.ly/4ba29BH
#2 - https://bit.ly/499zsmw
#3 - https://bit.ly/3EhWzOI
#IEEE #SSCS #JxCDC #Research #Engineering
December 2, 2025 at 6:33 PM
Top 3 most-cited articles from JxCDC
#1 - https://bit.ly/4ba29BH
#2 - https://bit.ly/499zsmw
#3 - https://bit.ly/3EhWzOI
#IEEE #SSCS #JxCDC #Research #Engineering
#1 - https://bit.ly/4ba29BH
#2 - https://bit.ly/499zsmw
#3 - https://bit.ly/3EhWzOI
#IEEE #SSCS #JxCDC #Research #Engineering
Call for Papers: IEEE JxCDC Special Topic on Ferroelectric Memory for AI! ⚡
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4qQsldc
#IEEESSCS #CircuitDesign
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4qQsldc
#IEEESSCS #CircuitDesign
September 17, 2026 at 8:34 PM
Call for Papers: IEEE JxCDC Special Topic on Ferroelectric Memory for AI! ⚡
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4qQsldc
#IEEESSCS #CircuitDesign
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4qQsldc
#IEEESSCS #CircuitDesign
Top 3 #JxCDC articles for July 2026! 📚⚡
1️⃣ 3D HBM for LLMs: https://bit.ly/4dcP8ey
2️⃣ Backside Signal Routing: https://bit.ly/4dKqlOQ
3️⃣ Probabilistic Computing: https://bit.ly/4ba29BH
#IEEESSCS #AIHardware #Semiconductors
1️⃣ 3D HBM for LLMs: https://bit.ly/4dcP8ey
2️⃣ Backside Signal Routing: https://bit.ly/4dKqlOQ
3️⃣ Probabilistic Computing: https://bit.ly/4ba29BH
#IEEESSCS #AIHardware #Semiconductors
August 27, 2026 at 8:09 PM
Top 3 #JxCDC articles for July 2026! 📚⚡
1️⃣ 3D HBM for LLMs: https://bit.ly/4dcP8ey
2️⃣ Backside Signal Routing: https://bit.ly/4dKqlOQ
3️⃣ Probabilistic Computing: https://bit.ly/4ba29BH
#IEEESSCS #AIHardware #Semiconductors
1️⃣ 3D HBM for LLMs: https://bit.ly/4dcP8ey
2️⃣ Backside Signal Routing: https://bit.ly/4dKqlOQ
3️⃣ Probabilistic Computing: https://bit.ly/4ba29BH
#IEEESSCS #AIHardware #Semiconductors
Call for Papers: IEEE JxCDC Special Topic on Ferroelectric Memory for AI! ⚡
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4dhHZsk
#IEEESSCS #CircuitDesign
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4dhHZsk
#IEEESSCS #CircuitDesign
September 4, 2026 at 8:33 AM
Call for Papers: IEEE JxCDC Special Topic on Ferroelectric Memory for AI! ⚡
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4dhHZsk
#IEEESSCS #CircuitDesign
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4dhHZsk
#IEEESSCS #CircuitDesign
Call for Papers: IEEE JxCDC Special Topic on Ferroelectric Memory for AI! ⚡
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4qQsldc
#IEEESSCS #CircuitDesign
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4qQsldc
#IEEESSCS #CircuitDesign
September 3, 2026 at 6:56 PM
Call for Papers: IEEE JxCDC Special Topic on Ferroelectric Memory for AI! ⚡
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4qQsldc
#IEEESSCS #CircuitDesign
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4qQsldc
#IEEESSCS #CircuitDesign
Call for Papers: IEEE JxCDC Special Topic on Ferroelectric Memory for AI! ⚡
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4qQsldc
#IEEESSCS #CircuitDesign
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4qQsldc
#IEEESSCS #CircuitDesign
September 3, 2026 at 5:58 PM
Call for Papers: IEEE JxCDC Special Topic on Ferroelectric Memory for AI! ⚡
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4qQsldc
#IEEESSCS #CircuitDesign
Seeking silicon demonstrations, in-memory compute & FEOL/BEOL integration.
📅 Open: Sept 2, 2026
⏰ Deadline: Nov 15, 2026
👉 Submit: https://bit.ly/4qQsldc
#IEEESSCS #CircuitDesign
Top 3 Most Cited #JxCDC Papers of 2025! 🏆
1️⃣ Probabilistic p-Bits: https://ieeexplore.ieee.org/document/10068500
2️⃣ 2-D TMD TFETs: https://ieeexplore.ieee.org/document/7085931
3️⃣ Physics-Inspired NNs: https://ieeexplore.ieee.org/document/7778193
Pioneering the frontier of beyond-CMOS computing! #IEEE
1️⃣ Probabilistic p-Bits: https://ieeexplore.ieee.org/document/10068500
2️⃣ 2-D TMD TFETs: https://ieeexplore.ieee.org/document/7085931
3️⃣ Physics-Inspired NNs: https://ieeexplore.ieee.org/document/7778193
Pioneering the frontier of beyond-CMOS computing! #IEEE
February 26, 2026 at 5:10 PM
Top 3 Most Cited #JxCDC Papers of 2025! 🏆
1️⃣ Probabilistic p-Bits: https://ieeexplore.ieee.org/document/10068500
2️⃣ 2-D TMD TFETs: https://ieeexplore.ieee.org/document/7085931
3️⃣ Physics-Inspired NNs: https://ieeexplore.ieee.org/document/7778193
Pioneering the frontier of beyond-CMOS computing! #IEEE
1️⃣ Probabilistic p-Bits: https://ieeexplore.ieee.org/document/10068500
2️⃣ 2-D TMD TFETs: https://ieeexplore.ieee.org/document/7085931
3️⃣ Physics-Inspired NNs: https://ieeexplore.ieee.org/document/7778193
Pioneering the frontier of beyond-CMOS computing! #IEEE
🚀 Big News: Dr. Asif Khan is the new Editor-in-Chief of IEEE JxCDC!
A @GeorgiaTech professor & semiconductor pioneer, Dr. Khan leads frontier research in low-power logic, AI hardware & beyond-CMOS tech.
Welcome to the leadership team, Dr. Khan! 👏
#IEEESSCS #Semiconductors #
A @GeorgiaTech professor & semiconductor pioneer, Dr. Khan leads frontier research in low-power logic, AI hardware & beyond-CMOS tech.
Welcome to the leadership team, Dr. Khan! 👏
#IEEESSCS #Semiconductors #
February 3, 2026 at 6:09 PM
🚀 Big News: Dr. Asif Khan is the new Editor-in-Chief of IEEE JxCDC!
A @GeorgiaTech professor & semiconductor pioneer, Dr. Khan leads frontier research in low-power logic, AI hardware & beyond-CMOS tech.
Welcome to the leadership team, Dr. Khan! 👏
#IEEESSCS #Semiconductors #
A @GeorgiaTech professor & semiconductor pioneer, Dr. Khan leads frontier research in low-power logic, AI hardware & beyond-CMOS tech.
Welcome to the leadership team, Dr. Khan! 👏
#IEEESSCS #Semiconductors #
🏆 Top June 2026 JxCDC papers:
1️⃣ FeFET PIM for DNN (Georgia Tech)
🔗 https://bit.ly/4jpEwIP
2️⃣ CMOS Oscillator Chains (Cornell/Intel)
🔗 https://bit.ly/4etJJjj
3️⃣ Robust RRAM Inference (ASU/IBM)
🔗 https://bit.ly/4acNTYa
#IEEE #CircuitDesign #AIHardware #Semiconductors
1️⃣ FeFET PIM for DNN (Georgia Tech)
🔗 https://bit.ly/4jpEwIP
2️⃣ CMOS Oscillator Chains (Cornell/Intel)
🔗 https://bit.ly/4etJJjj
3️⃣ Robust RRAM Inference (ASU/IBM)
🔗 https://bit.ly/4acNTYa
#IEEE #CircuitDesign #AIHardware #Semiconductors
July 30, 2026 at 3:35 PM
🏆 Top June 2026 JxCDC papers:
1️⃣ FeFET PIM for DNN (Georgia Tech)
🔗 https://bit.ly/4jpEwIP
2️⃣ CMOS Oscillator Chains (Cornell/Intel)
🔗 https://bit.ly/4etJJjj
3️⃣ Robust RRAM Inference (ASU/IBM)
🔗 https://bit.ly/4acNTYa
#IEEE #CircuitDesign #AIHardware #Semiconductors
1️⃣ FeFET PIM for DNN (Georgia Tech)
🔗 https://bit.ly/4jpEwIP
2️⃣ CMOS Oscillator Chains (Cornell/Intel)
🔗 https://bit.ly/4etJJjj
3️⃣ Robust RRAM Inference (ASU/IBM)
🔗 https://bit.ly/4acNTYa
#IEEE #CircuitDesign #AIHardware #Semiconductors
We are thrilled to launch the new JxCDC Best Paper Award, celebrating outstanding novelty, clarity, and impact in exploratory hardware! 🏆
Jointly sponsored by @IEEE_SSCS, @IEEE_EDS, Magnetics, CASS, and @IEEECEDA. 👇
🔗 https://bit.ly/4eFid2y
#Semiconductors #CircuitDesign
Jointly sponsored by @IEEE_SSCS, @IEEE_EDS, Magnetics, CASS, and @IEEECEDA. 👇
🔗 https://bit.ly/4eFid2y
#Semiconductors #CircuitDesign
July 2, 2026 at 9:50 PM
We are thrilled to launch the new JxCDC Best Paper Award, celebrating outstanding novelty, clarity, and impact in exploratory hardware! 🏆
Jointly sponsored by @IEEE_SSCS, @IEEE_EDS, Magnetics, CASS, and @IEEECEDA. 👇
🔗 https://bit.ly/4eFid2y
#Semiconductors #CircuitDesign
Jointly sponsored by @IEEE_SSCS, @IEEE_EDS, Magnetics, CASS, and @IEEECEDA. 👇
🔗 https://bit.ly/4eFid2y
#Semiconductors #CircuitDesign
📈 Most Cited JxCDC Articles in 2026!
1. Probabilistic Computing with p-Bits
🔗 https://bit.ly/4ba29BH
2. MTJs for Stochastic Computing
🔗 https://bit.ly/4u9uT65
3. Heterogeneous Integration for AI
🔗 https://bit.ly/4lpDY7A
#IEEE #JxCDC #AIHardware
1. Probabilistic Computing with p-Bits
🔗 https://bit.ly/4ba29BH
2. MTJs for Stochastic Computing
🔗 https://bit.ly/4u9uT65
3. Heterogeneous Integration for AI
🔗 https://bit.ly/4lpDY7A
#IEEE #JxCDC #AIHardware
June 4, 2026 at 10:15 PM
📈 Most Cited JxCDC Articles in 2026!
1. Probabilistic Computing with p-Bits
🔗 https://bit.ly/4ba29BH
2. MTJs for Stochastic Computing
🔗 https://bit.ly/4u9uT65
3. Heterogeneous Integration for AI
🔗 https://bit.ly/4lpDY7A
#IEEE #JxCDC #AIHardware
1. Probabilistic Computing with p-Bits
🔗 https://bit.ly/4ba29BH
2. MTJs for Stochastic Computing
🔗 https://bit.ly/4u9uT65
3. Heterogeneous Integration for AI
🔗 https://bit.ly/4lpDY7A
#IEEE #JxCDC #AIHardware
Exploratory Breakthroughs: Top JxCDC papers! 📈
3-D LLM Accelerators: Boosts throughput 4×.
🔗 https://bit.ly/4dcP8ey
Backside Routing: Saves 35% cell area.
🔗 https://bit.ly/4dKqlOQ
Probabilistic Computing: Full AI/ML review.
🔗 https://bit.ly/4ba29BH
#IEEE #JxCDC
3-D LLM Accelerators: Boosts throughput 4×.
🔗 https://bit.ly/4dcP8ey
Backside Routing: Saves 35% cell area.
🔗 https://bit.ly/4dKqlOQ
Probabilistic Computing: Full AI/ML review.
🔗 https://bit.ly/4ba29BH
#IEEE #JxCDC
June 2, 2026 at 8:03 PM
Exploratory Breakthroughs: Top JxCDC papers! 📈
3-D LLM Accelerators: Boosts throughput 4×.
🔗 https://bit.ly/4dcP8ey
Backside Routing: Saves 35% cell area.
🔗 https://bit.ly/4dKqlOQ
Probabilistic Computing: Full AI/ML review.
🔗 https://bit.ly/4ba29BH
#IEEE #JxCDC
3-D LLM Accelerators: Boosts throughput 4×.
🔗 https://bit.ly/4dcP8ey
Backside Routing: Saves 35% cell area.
🔗 https://bit.ly/4dKqlOQ
Probabilistic Computing: Full AI/ML review.
🔗 https://bit.ly/4ba29BH
#IEEE #JxCDC
📢 DEADLINE EXTENDED!
You now have until May 31 to submit to the JxCDC Special Topic on 3D Integration for AI Systems. 🛰️⚡
Focus: 3DHI, logic-on-memory, and thermal-aware AI design.
Details:
🔗 https://bit.ly/3LZez8e
#IEEESSCS #AI #3DHI #Semiconductors
You now have until May 31 to submit to the JxCDC Special Topic on 3D Integration for AI Systems. 🛰️⚡
Focus: 3DHI, logic-on-memory, and thermal-aware AI design.
Details:
🔗 https://bit.ly/3LZez8e
#IEEESSCS #AI #3DHI #Semiconductors
May 19, 2026 at 8:10 PM
📢 DEADLINE EXTENDED!
You now have until May 31 to submit to the JxCDC Special Topic on 3D Integration for AI Systems. 🛰️⚡
Focus: 3DHI, logic-on-memory, and thermal-aware AI design.
Details:
🔗 https://bit.ly/3LZez8e
#IEEESSCS #AI #3DHI #Semiconductors
You now have until May 31 to submit to the JxCDC Special Topic on 3D Integration for AI Systems. 🛰️⚡
Focus: 3DHI, logic-on-memory, and thermal-aware AI design.
Details:
🔗 https://bit.ly/3LZez8e
#IEEESSCS #AI #3DHI #Semiconductors
Call for Papers: IEEE JXCDC
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
May 5, 2026 at 7:21 PM
Call for Papers: IEEE JXCDC
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
Call for Papers: IEEE JXCDC
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
April 16, 2026 at 6:11 PM
Call for Papers: IEEE JXCDC
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
Call for Papers: IEEE JXCDC
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
March 5, 2026 at 10:15 PM
Call for Papers: IEEE JXCDC
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
🚀 Enhance Your Edge Computing Knowledge!
Join the IEEE SSCS Feb Technical Webinar on Weight-Input Transformations for ultra-low precision DNNs.
🗓 Feb 25, 2026 🕙 3:00–4:30 PM EST 👤 Dr. Sumeet Kumar Gupta & Imtiaz Ahmed (Purdue)
Register: https://bit.ly/46mTN9m
#JxCDC
Join the IEEE SSCS Feb Technical Webinar on Weight-Input Transformations for ultra-low precision DNNs.
🗓 Feb 25, 2026 🕙 3:00–4:30 PM EST 👤 Dr. Sumeet Kumar Gupta & Imtiaz Ahmed (Purdue)
Register: https://bit.ly/46mTN9m
#JxCDC
February 25, 2026 at 6:07 PM
🚀 Enhance Your Edge Computing Knowledge!
Join the IEEE SSCS Feb Technical Webinar on Weight-Input Transformations for ultra-low precision DNNs.
🗓 Feb 25, 2026 🕙 3:00–4:30 PM EST 👤 Dr. Sumeet Kumar Gupta & Imtiaz Ahmed (Purdue)
Register: https://bit.ly/46mTN9m
#JxCDC
Join the IEEE SSCS Feb Technical Webinar on Weight-Input Transformations for ultra-low precision DNNs.
🗓 Feb 25, 2026 🕙 3:00–4:30 PM EST 👤 Dr. Sumeet Kumar Gupta & Imtiaz Ahmed (Purdue)
Register: https://bit.ly/46mTN9m
#JxCDC
Call for Papers: IEEE JXCDC
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
February 12, 2026 at 9:49 PM
Call for Papers: IEEE JXCDC
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
Submit original works on physical realizations, cross-layer modeling & thermal-aware co-design to advance energy-efficient AI via 3D Heterogeneous Integration beyond planar limits.
📅 Deadline: May 15, 2026 🔗 https://bit.ly/3LZez8e
#AI #3DHI #IEEE
🚀 Enhance Your Edge Computing Knowledge!
Join the IEEE SSCS Feb Technical Webinar on Weight-Input Transformations for ultra-low precision DNNs.
🗓 Feb 25, 2026 🕙 3:00–4:30 PM EST 👤 Dr. Sumeet Kumar Gupta & Imtiaz Ahmed (Purdue)
Register: https://bit.ly/46mTN9m
#JxCDC
Join the IEEE SSCS Feb Technical Webinar on Weight-Input Transformations for ultra-low precision DNNs.
🗓 Feb 25, 2026 🕙 3:00–4:30 PM EST 👤 Dr. Sumeet Kumar Gupta & Imtiaz Ahmed (Purdue)
Register: https://bit.ly/46mTN9m
#JxCDC
February 11, 2026 at 5:53 PM
🚀 Enhance Your Edge Computing Knowledge!
Join the IEEE SSCS Feb Technical Webinar on Weight-Input Transformations for ultra-low precision DNNs.
🗓 Feb 25, 2026 🕙 3:00–4:30 PM EST 👤 Dr. Sumeet Kumar Gupta & Imtiaz Ahmed (Purdue)
Register: https://bit.ly/46mTN9m
#JxCDC
Join the IEEE SSCS Feb Technical Webinar on Weight-Input Transformations for ultra-low precision DNNs.
🗓 Feb 25, 2026 🕙 3:00–4:30 PM EST 👤 Dr. Sumeet Kumar Gupta & Imtiaz Ahmed (Purdue)
Register: https://bit.ly/46mTN9m
#JxCDC
JXCDC Special Topic on Non-Traditional Computing for Energy Efficiency is open for submissions
Topics:
- Spintronic, photonic, and superconducting devices
- Hybrid CMOS+X
- Energy-efficient AI hardware
📅 Deadline: Jan 15, 2026
🔗 https://bit.ly/3ILCwOs
#IEEE #SSCS
Topics:
- Spintronic, photonic, and superconducting devices
- Hybrid CMOS+X
- Energy-efficient AI hardware
📅 Deadline: Jan 15, 2026
🔗 https://bit.ly/3ILCwOs
#IEEE #SSCS
January 13, 2026 at 5:48 PM
JXCDC Special Topic on Non-Traditional Computing for Energy Efficiency is open for submissions
Topics:
- Spintronic, photonic, and superconducting devices
- Hybrid CMOS+X
- Energy-efficient AI hardware
📅 Deadline: Jan 15, 2026
🔗 https://bit.ly/3ILCwOs
#IEEE #SSCS
Topics:
- Spintronic, photonic, and superconducting devices
- Hybrid CMOS+X
- Energy-efficient AI hardware
📅 Deadline: Jan 15, 2026
🔗 https://bit.ly/3ILCwOs
#IEEE #SSCS
JXCDC Special Topic on Non-Traditional Computing for Energy Efficiency is open for submissions
Topics:
- Spintronic, photonic, and superconducting devices
- Hybrid CMOS+X
- Energy-efficient AI hardware
📅 Deadline: Jan 15, 2026
🔗 https://bit.ly/3ILCwOs
#IEEE #SSCS
Topics:
- Spintronic, photonic, and superconducting devices
- Hybrid CMOS+X
- Energy-efficient AI hardware
📅 Deadline: Jan 15, 2026
🔗 https://bit.ly/3ILCwOs
#IEEE #SSCS
December 10, 2025 at 3:46 PM
JXCDC Special Topic on Non-Traditional Computing for Energy Efficiency is open for submissions
Topics:
- Spintronic, photonic, and superconducting devices
- Hybrid CMOS+X
- Energy-efficient AI hardware
📅 Deadline: Jan 15, 2026
🔗 https://bit.ly/3ILCwOs
#IEEE #SSCS
Topics:
- Spintronic, photonic, and superconducting devices
- Hybrid CMOS+X
- Energy-efficient AI hardware
📅 Deadline: Jan 15, 2026
🔗 https://bit.ly/3ILCwOs
#IEEE #SSCS
🔥 Top JxCDC papers this month:
1️⃣ 3-D Stacked HBM for LLMs
🔗 https://ieeexplore.ieee.org/document/11192509
2️⃣ FeFET PIM for DNNs
🔗 https://ieeexplore.ieee.org/document/8740886
3️⃣ Ferroelectric Oscillators & Neurons
🔗 https://ieeexplore.ieee.org/document/8762114
#JxCDC #IEEE #SSCS #Semiconductors
1️⃣ 3-D Stacked HBM for LLMs
🔗 https://ieeexplore.ieee.org/document/11192509
2️⃣ FeFET PIM for DNNs
🔗 https://ieeexplore.ieee.org/document/8740886
3️⃣ Ferroelectric Oscillators & Neurons
🔗 https://ieeexplore.ieee.org/document/8762114
#JxCDC #IEEE #SSCS #Semiconductors
December 8, 2025 at 6:13 PM
🔥 Top JxCDC papers this month:
1️⃣ 3-D Stacked HBM for LLMs
🔗 https://ieeexplore.ieee.org/document/11192509
2️⃣ FeFET PIM for DNNs
🔗 https://ieeexplore.ieee.org/document/8740886
3️⃣ Ferroelectric Oscillators & Neurons
🔗 https://ieeexplore.ieee.org/document/8762114
#JxCDC #IEEE #SSCS #Semiconductors
1️⃣ 3-D Stacked HBM for LLMs
🔗 https://ieeexplore.ieee.org/document/11192509
2️⃣ FeFET PIM for DNNs
🔗 https://ieeexplore.ieee.org/document/8740886
3️⃣ Ferroelectric Oscillators & Neurons
🔗 https://ieeexplore.ieee.org/document/8762114
#JxCDC #IEEE #SSCS #Semiconductors
JXCDC Special Topic on Non-Traditional Computing for Energy Efficiency is open for submissions
Topics:
- Spintronic, photonic, and superconducting devices
- Hybrid CMOS+X
- Energy-efficient AI hardware
📅 Deadline: Jan 15, 2026
🔗 https://bit.ly/3ILCwOs
#IEEE #SSCS
Topics:
- Spintronic, photonic, and superconducting devices
- Hybrid CMOS+X
- Energy-efficient AI hardware
📅 Deadline: Jan 15, 2026
🔗 https://bit.ly/3ILCwOs
#IEEE #SSCS
November 13, 2025 at 3:47 PM
JXCDC Special Topic on Non-Traditional Computing for Energy Efficiency is open for submissions
Topics:
- Spintronic, photonic, and superconducting devices
- Hybrid CMOS+X
- Energy-efficient AI hardware
📅 Deadline: Jan 15, 2026
🔗 https://bit.ly/3ILCwOs
#IEEE #SSCS
Topics:
- Spintronic, photonic, and superconducting devices
- Hybrid CMOS+X
- Energy-efficient AI hardware
📅 Deadline: Jan 15, 2026
🔗 https://bit.ly/3ILCwOs
#IEEE #SSCS