Micron has stopped considering 4F² a promising direction for DRAM development. After approximately 20 years of research, the company concluded that this architecture does not provide a significant increase in memory density, complicates manufacturing, raises costs, and has fundamental scaling limitations. 4F² memory cells have long been considered one of the most promising technologies in […] Post Micron Abandons 4F² DRAM After 20 Years of Research: The Company Explained Why at Root-Nation.com.

A GPU burns 700 watts and hundreds of thousands of tries to learn Pong. A human brain does it on 20 watts in a handful of attempts. So what can the oldest architecture in computing teach us about where agents and memory are headed?

CORVALLIS, Ore. – Inspired by the human brain, Oregon State University researchers have developed a new light-sensitive device that combines sensing and memory while controlling how digital memories s...

LPDDR6 standard finalized for mobile and AI first deploymentsMemory brings faster speed better efficiency and added security featuresDesktop systems expected to follow mobile and embedded device rollouts...

SK hynix revealed that Intel's upcoming Xeon 'Diamond Rapids' CPUs will adopt 2nd Gen MRDIMMs and its next-generation Gaudi AI accelerator 'Jaguar Shores' will feature SK hynix HBM4 memory.

A modest beginning with massive growth over 25 yearsOver 12 billion SD and microSD cards have been sold across consumer and industrial devicesSD Express cards now reach speeds of 4GB/s, up from just 12.5MB/s...

FMC and Neumonda develop non-volatile FeRAM products, revive memory production in Germany.

Micron's 1γ fabrication technology with EUV, new HKMG, and BEOL promises to increase performance while cutting power consumption for DRAM.

Sandisk says 3D Matrix Memory will be an affordable replacement for DRAMWill deliver DRAM-like performance at 4x the capacity and half the cost Sandisk says it will become more affordable as the technology...

A hidden electron shortcut inside new memory devices could revolutionize AI by making systems faster, more energy-efficient, and more reliable than ever before.

The crisis in the RAM market is not over, but the largest manufacturers are already preparing for the next stage. While consumers are struggling to find affordable DDR5, DDR4, and now even DDR3 modules, companies are already working on the new DDR6 standard. Samsung, SK Hynix, and Micron have reportedly begun the early stages of […] Post Next-gen memory: Samsung, SK Hynix, and Micron begin DDR6 development at Root-Nation.com.

Samsung has unveiled a breakthrough ferroelectric transistor (FeFET) memory technology capable of boosting storage capacity while cutting energy consumption

The idea of the human body uploading its own memories once belonged to speculative fiction. Today, it is cautiously stepping into reality. As

The Memristor market is projected to grow from USD Billion 0.5937 in 2024 to USD Billion 12.51 by 2035, at a CAGR of 31.93% during 2025-2035.

SoftBank's subsidiary SaiMemory teams up with Intel to develop ZAM memory, winning a subsidy from Japan's NEDO. The low-power HBM alternative is set to revolutionize AI workloads.