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Apple plans to use TSMC’s new WMCM and SoIC packaging for A20 and server chips in 2026, aiming for more efficient but complex chip designs. 🤔🔧

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An alleged image of the iPhone 18 Pro motherboard has leaked online, showing the A20 Pro chip will use a new packaging technology that should offer notable performance gains over the previous model. The leaked image, which has been shared by the accounts "WHYLAB" and "Ice Universe" on Weibo, appears to show the A20 Pro chip integrated into TSMC's new packaging architecture, known as Wafer-Level Multi-Chip Module (WMCM) technology. Traditionally, Apple has used package-on-package (PoP) designs, where the DRAM sits directly on top of the application processor. The advantages of this method are lower power consumption and reduced latency, but it also makes heat concentrated in the packaging area. In the leaked WMCM implementation, by contrast, the DRAM has been moved to the side of the package, which should reduce thermal coupling between the processor and DRAM while improving heat dissipation during sustained workloads. Apple's design is also said to be equipped with LPDDR6 memory with a 96-bit memory bus, which should provide more energy-efficient bandwidth. The chip size is said to be roughly the same as the A19 Pro, but the Neural Processing Unit (NPU) appears to be significantly larger, suggesting that Apple is also aiming to improve AI performance. The leaked image has not been confirmed as authentic, but the WMCM technology has been repeatedly rumored for the iPhone 18 Pro and iPhone 18 Pro Max. Powered by the A20 Pro chip, the foldable iPhone and iPhone 18 Pro models are also expected to use TSMC's new 2nm process, also known as N2, boasting performance improvements that could be up to 15 percent faster and 30 percent more efficient than A19 chips. Alleged leaked image of A20 Pro chip In addition, N2 introduces new super-high-performance metal-insulator-metal (SHPMIM) capacitors into the chip's power delivery system. These capacitors more than double the capacitance density of the previous generation. Together with the adoption of WMCM, the changes should boost performance globally and improve power stability and energy efficiency. The Pro and Fold models are expected to share 12GB of RAM, 48-megapixel rear cameras, and Apple's C2 modem. All three models are expected to be released in September this year.Related Roundup: iPhone 18 ProTag: Ice Universe This article, "Leaked A20 Pro Image Hints at iPhone 18 Pro Performance Gains" first appeared on MacRumors.com Discuss this article in our forums

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging method, and the world's leading pure-play foundry has reportedly already established a dedicated production line for Apple in anticipation of mass production in 2026. According to previous reports, Apple's A20 chip in iPhone 18 models will switch from the previous InFo (Integrated Fan-Out) packaging to WMCM (Wafer-Level Multi-Chip Module) packaging. Technically, the differences between the two packaging methods are quite striking. InFo allows integration of components, including memory, within the package but focuses more on single-die packaging where memory is typically attached to the main SoC (such as DRAM placed on top or near the CPU and GPU cores). It's optimized for reducing the size and improving the performance of individual chips. WMCM, on the other hand, excels at integrating multiple chips within the same package (hence the "Multi-Chip Module" part). This method allows more complex systems, such as CPUs, GPUs, DRAM, and other custom accelerators (e.g., AI/ML chips) to be tightly integrated in one package. It provides greater flexibility in arranging different types of chips, stacking them vertically or placing them side by side, while also optimizing communication between them. TSMC plans to start manufacturing 2nm chips in late 2025, and Apple is expected to be the first company to receive chips built on the new process. TSMC generally builds new fabs when it needs to increase production capacity to handle significant orders for chips, and TSMC is expanding in a major way for 2nm technology. To serve its major client Apple, TSMC has established a dedicated production line at its Chiayi P1 fab, where WMCM packaging monthly capacity is expected to reach 10,000 units by 2026, reports DigiTimes. According to Apple analyst Ming-Chi Kuo, only "Pro" models in the iPhone 18 series are likely to use TSMC's next-generation 2nm processor technology because of cost concerns. Kuo also believes that the iPhone 17 Pro will feature 12GB of RAM as a result of the new packaging method. Terms like "3nm" and "2nm" describe generations of chip manufacturing technology, each with its own set of design rules and architecture. As these numbers decrease, they generally indicate smaller transistor sizes. Smaller transistors allow more to be packed onto a single chip, typically resulting in increased processing speed and improved power efficiency. Last year's iPhone 16 series is based on an A18 chip design built using a second-generation "N3E" 3nm process. Meanwhile, this year's upcoming iPhone 17 lineup is expected to use A19 chip technology that's likely built on an upgraded 3-nanometer process called "N3P." Compared to earlier versions of 3nm chips, the N3P chips offer increased performance efficiency and increased transistor density.Related Roundup: iPhone 18Tag: DigiTimesRelated Forum: iPhone This article, "iPhone 18's Advanced A20 Chip Packaging Gains Momentum at TSMC" first appeared on MacRumors.com Discuss this article in our forums

In a research note today, Apple supply chain analyst Ming-Chi Kuo suggested that MacBook Pro models with M5 chips might not launch until 2026. Kuo discussed how the iPhone 18 Pro's A20 Pro chip will be packaged with WMCM (Wafer-Level Multi-Chip Module) technology, which integrates the so-called "underfill and molding processes" for more efficient manufacturing and increased yield, a term that refers to the percentage of functional chips that can be obtained per silicon wafer. Kuo went on to say that high-end M5 chips in 2026 MacBooks — likely referring to the M5 Pro and M5 Max chips — will continue to have separate underfill and molding processes during production. His mention of 2026 is the key part here, as it was previously rumored that MacBook Pro models with M5 chips would launch in late 2025. Last month, however, Bloomberg's Mark Gurman reported that Apple was "considering" pushing back the release of the next MacBook Pro models with the M5 series of chips until 2026. All in all, Kuo's mention of "2026 MacBooks" with high-end M5 chips is the latest clue that the MacBook Pro might not be updated this year after all. Timing aside, we recommend skipping the MacBook Pro models with the M5 series of chips if you can wait, as the subsequent models with the M6 series of chips are expected to feature more significant changes, including an OLED display, a thinner design, and possibly a smaller notch. However, those models might not launch until early 2027 now.Related Roundup: MacBook ProTag: Ming-Chi KuoBuyer's Guide: MacBook Pro (Caution)Related Forum: MacBook Pro This article, "MacBook Pro Models With M5 Chips Might Not Launch Until Next Year" first appeared on MacRumors.com Discuss this article in our forums

Apple's A20 chip in the iPhone 18 will be packaged with TSMC's Wafer-Level Multi-Chip Module (WMCM) technology, according to Apple supply chain analyst Ming-Chi Kuo. This change has been rumored by multiple other sources previously. Apple would be moving away from TSMC's InFO (Integrated Fan-Out) packaging it uses currently. It is unclear if this change will be limited to higher-end models, like the iPhone 18 Pro and the so-called "iPhone 18 Fold," or if it will extend to the standard iPhone 18 and iPhone 18 Air. Kuo's research note today mentioned a second half of 2026 timeframe, which is when the iPhone 18 Pro and foldable iPhone are expected to launch. The Information said the lower-end iPhone 18 models will not be released until spring 2027. In any case, at least some A20 chips would have RAM integrated directly onto the same wafer as the CPU, GPU, and Neural Engine, rather than sitting adjacent to the chip and connected via a silicon interposer. This could contribute to faster performance for both overall tasks and Apple Intelligence, and longer battery life from improved power efficiency. A20 chips may take up less space in the iPhone compared to previous chips. A20 chips are also expected to be manufactured with TSMC's 2nm process, which would also contribute to faster performance and improved power efficiency over A18 and A19 chips, which are or will be fabricated with TSMC's 3nm processes. All in all, A20 chips in iPhone 18 models are shaping up to have significant underlying changes.Related Roundup: iPhone 18Tag: Ming-Chi KuoRelated Forum: iPhone This article, "A20 Chips in iPhone 18 Models Again Rumored to Feature New Design" first appeared on MacRumors.com Discuss this article in our forums

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Apple’s iPhone 18 is already drawing industry attention, with rumors around its chip packaging further raising expectations. According to Wccftech, ci...

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TSMC, Intel, and Samsung lead the charge with WMCM, glass substrates + EMIB, and HPB thermal tech, driving AI, HPC, and mobile performance in the post-Moore era. Market set to exceed $79B by 2028.

「iPhone 18」シリーズに搭載されるApple A20チップは、TSMCのWafer-Level Multi-Chip Module (WMCM) 技術を採用する予定であることをAppleのサプライチェーンアナリストMing-Chi Kuo氏が報告しています。 A20チップは、これまでのチップとは大きく変わる設計刷新をすることになりそうです。 Apple A20チップのイメージ：MacRum...